YINCAE has unveiled its latest innovation in underfill materials with the introduction of UF 158UL. This advanced underfill solution is engineered to address the increasing challenges associated with large format chips, offering superior performance in flowability, rapid curing, and long-term reliability. As semiconductor technology continues to evolve, the need for highly efficient and dependable underfill materials becomes more critical, partic...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

YINCAE, a specialist manufacturer of electronic materials, has announced the launch of its new product, UF 120HA.