X-FAB Semiconductor Foundries AG
- Haarbergstr. 67
99097 Erfurt
Germany - +49-361-427 6000
- http://www.xfab.com
- +49-361-427 6111
X-FAB Semiconductor Foundries AG Articles
X-FAB announces SMART photonics collaboration at electronica 2024
At electronica 2024, X-FAB announced its latest collaboration with SMART Photonics to drive photonics innovations within datacom, telecom and beyond.
New generation of photodiodes from X-FAB
X-FAB Silicon Foundries SE has introduced additional optoelectronic device options to strengthen its portfolio.
X-FAB and Soitec team up
X-FAB and Soitec are set to collaborate on offering Soitec’s SmartSiC wafers for the production of silicon carbide power devices at the former's facility in Lubbock, Texas.
X-FAB and Soitec team up to offer SmartSiC at Lubbock plant, USA
X-FAB (Euronext Paris), a global pure-play foundry pioneer serving a large variety of fabless customers, and Soitec (Euronext Paris), one of the leaders in designing and manufacturing innovative semiconductor materials, will begin work to offer Soitec’s SmartSiC wafers for the production of silicon carbide power devices at X-FAB’s plant in Lubbock, Texas.
X-FAB enhances automotive-grade high-voltage CMOS foundry
X-FAB has updated its XP018 high-voltage CMOS semiconductor fabrication platform with new 40V and 60V high-voltage primitive devices, which feature an extended SOA for improved operational robustness.
New gen of SPAD devices for near-infrared applications
X-FAB Silicon Foundries SE, an analog/mixed-signal and specialty foundry, has introduced a near-infrared version of its single-photon avalanche diode (SPAD) device portfolio.
X-FAB adds CMOS integration option to its galvanic isolation solution
X-FAB Silicon Foundries SE, the analog/mixed-signal and specialty foundry, is making further significant progress with its galvanic isolation technology.
X-FAB set to receive funding for semiconductor technology innovation
X-FAB Group is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT).
EuMW 2023: X-FAB has integrated passive device process
X-FAB Silicon Foundries has added to its broad proficiency in RF by announcing new integrated passive device (IPD) fabrication capabilities at European Microwave Week in Berlin (17 to 22 September).
X-Fab unveils 110nm BCD-on-SOI process
X-FAB Silicon Foundries SE says it has built on its position in BCD-on-SOI technology, by being the first foundry to introduce a 110 nm solution.
X-FAB introduces 180nm BCD on SOI technology
X-FAB has intreduced its180-nanometre BCD (bipolar-CMOS-DMOS) on SOI (silicon on insulator) technology that supports an operating voltage of 375V.
AMS reference design kit for Tanner IC design tools
X-FAB Silicon Foundries has announced the release of a reference design kit for Tanner analogue/mixed-signal (AMS) software from the EDA segment of Siemens Digital Industries Software. The new kit is based on silicon-proven circuitry, providing full coverage of the flow to design and simulate analogue and mixed-signal ICs.
Automotive embedded flash with 180nm high-voltage CMOS
X-FAB Silicon Foundries has introduced a new embedded Flash memory capability for its XP018 high-voltage automotive process. This new Flash IP leverages X-FAB’s already widely proven Silicon Oxide Nitride Oxide Silicon (SONOS) technology, which offers a combination of elevated levels of performance and best-in-class reliability.
Process variant brings boost in photodiode responsiveness
X-FAB Silicon Foundries has made augmentations that extend the scope of its XS018 180nm sensor process. As a result, the company is now able to offer a photodiode-specific process core module. Whereas previously the XS018 process had been mainly focused on the fabrication of multi-pixel CMOS image sensors, this new module is dedicated to photodiode fabrication.
X-FAB enters into collaboration with IHP
X-FAB Silicon Foundries and IHP have announced an industry-academic partnership. The objective of the cooperation between these two bodies, which brings together X-FAB’s proficiency in semiconductor manufacture with IHP’s wireless communication expertise, is to exchange knowledge and establish mutually beneficial engineering synergies.
APD and SPAD devices enhanced with photon detection
X-FAB Silicon Foundries has just introduced its latest generation of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) devices. Leveraging its proven automotive-qualified 180nm XH018 high-voltage process, X-FAB’s new APDs and SPADs benefit from innovative architectural modifications, with substantial improvements in performance exhibited compared with the company’s earlier devices (which were initially announced back...
Microfluidic structures on CMOS dies
X-FAB Silicon Foundries SE has announced that it is now able to offer a series of solutions that support the implementation of microfluidic structures directly on to CMOS dies. Through these, customers will be better able to address commercial opportunities arising that relate to lab-on-a-chip, DNA sequencing and synthesis, rare cell sorting, medical implants, pharmaceutical research, drug administering, food safety testing and many other applica...
I-fuse OTP memory solution on X-FAB 130nm RF-SOI
X-FAB Silicon Foundries and with Attopsemi, have entered into a collaboration to satisfy the memory requirements of 5G technology. The companies have announced successful qualification of Attopsemi’s I-fuse OTP memory in relation to X-FAB’s XR013 open-platform foundry 130nm RF-SOI technology.
Jörg Doblaski takes on the role of X-FAB CTO
X-FAB Silicon Foundries SE has announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.
X-FAB expands offering for silicon-based microfluidics
In order to address heightening demands, X-FAB Silicon Foundries has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies. Part of its extensive MEMS-oriented technology offering, the company is now able to provide a large variety of process capabilities for silicon- based microfluidic systems.