Companies

WIN Semiconductors

WIN Semiconductors Articles

Displaying 1 - 11 of 11
Design
18th June 2024
WIN Semiconductors releases moisture-resistant tech

WIN Semiconductorshas announced the beta release of its moisture-resistant 0.1µm pHEMT technology, PP10-29.

Communications
14th June 2023
Next generation mmWave enhancement/depletion GaAs technology

WIN Semiconductors Corp announces the commercial release of its next generation integrated mmWave GaAs platform, PQG3-0C.

Products
27th June 2022
WIN Semiconductors releases 0.12µm RF GaN on SiC technology

The NP12-01 platform provides increased gain and efficiency for high transmit power applications through Ka-band

Power
24th June 2022
WIN Semiconductors releases 0.1µm GaAs pHEMT Technology

WIN Semiconductors, a compound semiconductor foundry, announces the release of its 0.1µm pHEMT technology, PP10-20.

Frequency
6th June 2019
GaN process for high power mmWave applications

Pure-play compound semiconductor foundry, WIN Semiconductors, has expanded its gallium nitride (GaN) portfolio with the commercial release of a 0.15?m-gate technology, NP15-00, that supports emerging mmWave PA applications including radar, satellite communications and 5G massive MIMO infrastructure.

5G
5th June 2019
Integrated GaAs technology enables single chip GaAs solutions for 5G

Pure-play compound semiconductor foundry, WIN Semiconductors, has announced the commercial release of its high integration mmWave GaAs platform, PIH1-10. Optimised for 5G front-ends, the PIH1-10 technology combines an advanced 100GHz ƒt enhancement-mode pHEMT with monolithic PIN and Schottky diodes to provide best in class mmWave performance for all front-end functions.

Communications
11th October 2018
Integrated GaAs technologies deliver high performance mmWave

WIN Semiconductors is driving the development and deployment of 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands. Front-end semiconductor technology has a significant influence on battery life and total power consumption of mobile devices and active antenna arrays employed in mmWave network infrastructure.

Component Management
30th September 2018
GaAs technology spearheads mmwave 5G chip production

As 5G user equipment and network infrastructure in the sub-6GHz and mmWave frequency bands rolls out, GaAs technology will play an important role because front-end semiconductor technology has a significant influence on battery life and total power consumption of mobile devices and active antenna arrays employed in mmWave network infrastructure.

Design
13th June 2018
Platform integrates high performance 0.1um GaAs pHEMT

WIN Semiconductors has expanded its portfolio of highly integrated GaAs technologies with the release of a pHEMT technology. The PIH0-03 platform incorporates monolithic PIN and vertical Schottky diodes with WIN’s high performance 0.1um pseudomorphic HEMT process, PP10. This integrated technology, PIH0-03, adds a highly linear vertical Schottky diode with cut-off frequency over 600GHz, as well as multi-function PIN diodes while preserving t...

5G
11th June 2018
0.45um GaN power process for 5G applications

To support current and future 5G applications, WIN Semiconductors has expanded its gallium nitride (GaN) process capabilities to include a 0.45um-gate technology. The NP45-11 GaN-on-SiC process from WIN Semiconductors allows customers to design hybrid Doherty power amplifiers used in 5G applications including MIMO (multiple-input and multiple-output) wireless antenna systems. MIMO base stations often combine Doherty power amplifiers with linearis...

Power
12th October 2017
Technology provides 28V operation with superior power density

  The largest pure-play compound semiconductor foundry, WIN Semiconductors has released an optimised version of its 0.25µm gallium nitride technology, NP25, which provides superior DC and RF transistor performance.

First Previous Page 1 of 1 Next Last

Featured products

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier