A HighDensity module is being offered by Viscom in addition to standard camera equipment for inspecting conformal coatings in electronics production. It can provide a better option, particularly where silicone or especially thin coatings need to be reliably inspected. The module will be on display at electronica in Munich (November 8-11).

Viscom has announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature at NEPCON South China. Viscom’s display will range from manual 3D microfocus X-ray computed tomography, high precision wire-bond, and powerful 3D solder paste inspection, to fully automatic high-speed, in-line 3D AOI and AXI inspection.    

The dates for this year's Viscom Technology Forum and User Meeting will be June 8 and 9. Like earlier years the event offers many opportunities for exchanging knowledge and experience since the content is tailored not only to those delegates who already use Viscom systems, but also to participants who are interested in inspection solutions from the company and would like to learn more about them.

Viscom has reworked its MXI system X8011 PCB and launched the result as the X8011-II PCB. It will be presented at SMT Hybrid Packaging 2016 taking place in Nuremberg.

Viscom's X7058 was specially developed for an ultra-fast, in-line-capable automatic 3D X-ray inspection of electronic assemblies. With this system, the entire electronic assembly is 100 percent 3D-inspected and will be of  particular interest for EMS companies which need to produce and inspect complex, high-value electronic assemblies at the highest quality efficiently and at low cost.

Viscom announced that its S3088 SPI system will be featured in the SMTA International, National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th to 30th September, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of t...

At SMTA International, 29th to 30th September in Rosemont, Illinois, USA, Viscom will exhibit the company’s latest 3D AOI and CCI (Conformal Coating Inspection) systems in Booth #506. The S3088 CCI system inspects coatings quickly and reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impurities or splashes.

  Viscom is currently equipping its X7056 system for automatic 3D in-line X-ray inspection with flat panel detectors. For combined AXI/AOI inspection, the system can also be assembled with an AOI unit and the high-performance module XM 3D.

Viscom’s inspection experts will present its advanced SPI, AOI and X-ray portfolio as the company exhibits in Booth 1017 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015 at the San Diego Convention Centre, California.

Viscom has extended its portfolio in the x-ray inspection range with a flexible inspection system. The X8068 universal x-ray inspection system unites the high inspection quality and technology of the Viscom x-ray systems with an extended inspection scope for larger electronic assemblies. With this solution, electronics manufacturers could not be better equipped as far as both test piece size and application are concerned.

Viscom will be demonstrating the S3088 Conformal Coating Inspection (CCI) system at electronica in Munich (Nov 11-14). The system which inspects protective conformal coating quickly, with full reliability is now being offered with an extended inspection scope. The system can now be equipped with angled cameras for reliable inspection between components. A wet inspection that checks the conformal coating for flaws before complete curing also is av...

Power module manufacturer Danfoss Silicon Power has supplemented its existing Viscom X8051 with additional X7056BO combo-systems for wire bond inspection. Using the recognition of bond feet to analyse how the wire must lie, the X7056BO inspects the path of the wire in wire bond connections with AOI. Boasting reduced acquisition costs, low false alarm rates and a high productivity, Danfloss currently has four X7056BO systems.

Jacques L’Heureux, the Business Development Manager for Viscom, will present the paper titled “Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils with Non-Coated Results” at SMTAI 2014. Co-authored by Viscom’s President Carsten Salewski, the paper will be presented during Session PRC2, titled ”Advances in Production Inspection Methods.” It is scheduled to take place on Tuesday 30th S...

  At SMTA International, September 30th to October 1st in Illinois, USA, Viscom’s inspection experts will present the company's advanced and comprehensive SPI, AOI and X-ray portfolio in Booth #434.

After extensive testing, Panasonic have implemented Viscom's closed-loop interface into it's printers and placement machines. The interface, developed by the two companies, provides a closed control loop between solder paste inspection (SPI) and printer. This allows the print process to be inspected and immediately optimised. To automatically correct the printing process, data is sent from the SPI directly to the printer. 

In Booth A-1C36 at Nepcon South China 2014, Viscom will present what they claim to be is the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market. Amongst the portfolio on display will be the S3088 AOI/SPI systems and the 3D AOI XM camera module.

  Inspection plan generation and analysis software for inspection systems has been released by Viscom. SI 7.47 features Quality Uplink, a downlink function for Solder Paste Inspection (SPI), Integrated Verification, µBGA analysis and an XM converter.

In modern electronics manufacturing, short cycle times with no quality loss plays a critical role in increasing productivity. The new FastFlow concept from Viscom takes this demand into account. The high-speed transport optimizes throughput and shortens cycle time.

In modern electronics manufacturing, short cycle times with no quality loss plays a critical role in increasing productivity. The FastFlow concept from Viscom takes this demand into account. The high-speed transport optimizes throughput and shortens cycle time.

At the IPC APEX EXPO, March 25-27, 2014 in Vegas, Nevada, Viscom will highlight the 3D function in the AOI high-performance camera module XM. The company will also present their portfolio for solder paste inspection (SPI), automated optical inspection (AOI), conformal coating inspection (CCI) and X-ray inspection.