Versarien has introduced a series of next-gen thermal management solutions optimised specifically for deployment in modern, streamlined, high density electronic designs. Its low profile heatsinks utilise VersarienCu proprietary microporous copper technology to deliver industry-leading thermal performance for passive implementations at attractive price points.

Versarien has announced that its graphene development subsidiary, 2-DTech, has made a major advance in graphene platelet production, which the company believes will accelerate potential commercial applications for graphene and graphene products. As a result of 2-DTech‘s investment programme, it has developed its own proprietary graphene production technique founded upon a licenced process from the University of Ulster.

Versarien has announced a range of heat sink products based upon VersarienCu copper foam technology. This range is designed for use in passive cooling applications where space is at a premium and performance is crucial. The sinks can potentially be used to cool any IC component, with applications including PMICs, STBs, AP routers, cable modems, broadband, optical networks and LED TVs. 

A range of low profile, air cooled heat sinks has been introduced by Versarien Technologies. The heat sinks feature the company’s VersarienCu material, a copper foam which features fine, open, interconnected pores that emulate structures commonly found in nature. These pores increase the surface area of the heat sinks, which allows them to be reduced in size and provide an improved thermal performance.

Versarien announces the introduction of its own brand of advanced computer platforms with cutting-edge functionality driven by innovative proprietary technology. The VersarienPC family will be differentiated from the competition through significant operational advantages in comparison to conventional fan-cooled products.