Unisem, a global provider of semiconductor assembly and test services, has won the Packaging Process Showdown at MEMS & Sensors Technical Congress (MSTC) for its presentation MEMS Cavity Packages —The Applications, Options and Considerations

Unisem announced the availability of Teradyne J750Ex digital instrumentation for program development and production test at its facility in Sunnyvale, California. Unisem is a long-time J750 customer and recently adopted J750Ex digital instrumentation to extend the range of semiconductor test applications it can serve with the J750 platform.

Unisem today announced that it has now added twelve inch wafer probing capability to its test floor in Sunnyvale, CA. Accretech’s next generation prober, the UF3000EX will not only provide twelve inch probe capability but also has many other key features such as high speed wafer handling, a low-noise XY stage, and industry leading accuracy with its OTS (Optical Target Scope) positioning technology.

Unisem Advanced Technologies (UAT), a leading provider of wafer bumping technologies, today announced that it has developed a methodology for creating a stress buffer to protect delicate features of semiconductor devices. This customizable stress buffer structure includes a polymer layer formed by one or multiple coatings, and a metal stack overlaying the polymer.