United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.

Customers can leverage UMC and Cadence technologies to create designs for 5G, IoT, Displays, and Other Emerging Applications.

IBM and United Microelectronics Corporation is pleased to announce today that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

eMemory and United Microelectronics Corporation today announced an expanded technology cooperation to integrate eMemory's one-time-programmable and multiple-time-programmable embedded non-volatile memory technologies into UMC's 28nm process.

Faraday Technology and United Microelectronics today announced that they have produced customer system-on-chip (SoC) ICs with a density of over 300 million gates. The successful fabrication of the communication infrastructure ICs demonstrates the two companies' ability to deliver highly complex SoCs for third-party customers with lower development risk, design effort, and overall time-to-market.

United Microelectronics Corporation today announced that it has qualified the foundry industry's first high voltage embedded flash (eFlash) process that incorporates a true 12-volt solution. This 12V process enables single chip integration with improved signal-to-noise ratio for mid to large panel touch screen applications by combining the HV component that drives the sensor elements with the embedded flash memory that stores the control algorith...