Industry specialist in the miniaturisation of photorelays, Toshiba Electronics Europe, has introduced a new family of five photorelays housed in an very small package. The new devices are best suited for use in automatic test equipment, memory testers, SoC/LSI testers and probe cards. 

The line-up of DC brushed motor driver ICs from Toshiba Electronics Europe, has been expanded with a highly efficient, single-channel H-bridge driver offering a maximum rating of 50V/3.5A and low standby current. Supplied in a compact, HSOP8 surface mount package and featuring a popular pinout, the TB67H450FNG is suited for new DC brushed motor designs.

It has been announced by Toshiba Electronics Europe that their high-current photorelays are now available with UL 508 certification. All of the nine devices in the series include low on-state resistance MOSFETs based upon Toshiba’s U-MOS VIII process that ensure high performance in a wide range of applications.

It has been announced that Toshiba Electronics Europe has added the M4G Group to its TXZ Family of ARM Cortex-M-based microcontrollers for office automation (OA) equipment, audio-visual (AV) equipment, and industrial equipment. The M4G Group is based on the ARM Cortex-M4 core with a floating-point unit (FPU).

  Compared to traditional bicycle, e-bikes are significantly more expensive and consumers are looking for touchscreen interfaces and convenience, says Sven Hegner, chief engineer, Toshiba Electronics Europe

It has been announced that Toshiba Electronics Europe will be exhibiting at PCIM Europe from 7th to 9th May, where the latest innovations in semiconductor and optoelectronic technologies that can improve efficiency and thermal performance, will be showcased. Solutions supporting automotive, power and motor drive applications are demonstrated in hall nine at the Toshiba booth 301.

Toshiba Electronics has announced their range of single-supply single-gate logic devices. In total the lineup consists of 31 devices that simplify the design of voltage-level translation as used in data communication between devices, such as between microprocessors and peripherals. These single-gate devices are provided in tiny packaging that ensure that voltage translation can be implemented even in applications with limited board space.

Toshiba Memory Europe has announced that its KumoScale shared accelerated storage software now supports TCP (Transmission Control Protocol) transport in its 3.9 production release. By leveraging TCP, the most widely-used and trusted networking protocol in today’s enterprise and cloud data centres, KumoScale software enables NVM Express over Fabrics (NVMe-oF) to be deployed over existing Ethernet networks, opening opportunities for broader N...

Toshiba Memory Europe has announced that the newly released PM5 Series of 12Gb/s enterprise SAS SSDs has earned VMware vSAN 6.7 certification, enabling these flash-based storage devices to be shared across connected hosts in a VMware vSphere cluster. With vSAN 6.7 certification, users can pool PM5 Series SSDs together in a single, distributed, shared data store.

Toshiba Memory has announced that it has begun sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions. The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32, 64, 128, and 256GB.

Toshiba Electronics has launched two new series of small surface mount LDO regulators for application in the power supply of mobile devices, imaging and audio-visual products. The 40 regulators in the TCR5BM series support a dropout voltage (VDO) as low as 100mV and a maximum output current of 500mA, while 40 additional devices in the TCR8BM series extend options with a 170mV VDO and 800mA output current. The TCR5BM and TCR8BM series are bot...

Toshiba Memory Europe has announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash memory products for consumer applications. The new products integrate Toshiba Memory’s 15nm BiCS FLASH 3D flash memory and a controller in a single package. All of the new products support the command queuing and secure write protection functions, specified as an option in the standard.

The availability of the XD5 Series NVMe SSD platform in a 2.5” low-profile form factor that is optimised for low-latency and performance consistency in read-intensive workloads, has been announced by Toshiba Memory Europe. Developed for both data centre and cloud environments, the new 2.5” form factor XD5 Series is suited for NoSQL databases, large-scale-out data mining and analysis, and streaming applications.

It has been announced that Toshiba Electronics Europe has started sample shipments of an automotive DC motor driver IC with a LIN (Local Interconnect Network) slave function that can communicate with a LIN 2.0 master IC for in-vehicle networks. The new TB9058FNG is suitable for many applications requiring up to 0.3A drive current using LIN BUS including heating, ventilation and air conditioning (HVAC) damper control drivers. 

Toshiba has announced the development of an image recognition SoC (System on Chip) for automotive applications that implements deep learning accelerator at ten times the speed and four times the power efficiency of Toshiba’s previous product. Details of the technology were reported at the 2019 IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco on 19th February.

It has been announced that Toshiba Memory Europe and OSR Enterprises (OSR), creator of the EVOLVER automotive platform, will extend their collaboration on OSR’s in-car Datacenter to enhance live data management and logging in cars. The cooperation will combine technical know-how and hopes to create a ‘Datacenter on Wheels’ with high-density and low-power solid state drives.

  Toshiba Electronics has released a dual MOSFET with high levels of ESD protection. The new SSM6N813R is intended for use in rugged automotive applications, including use as a driver IC for headlight LEDs, which require a high withstand voltage and a small footprint.

With mobile product shipments, dominated by smartphones, continuing to account for a significant amount of the non-volatile memory (NVM) market, suppliers and standardisation organisations are working hard to ensure that next-generation NVMs keep up with the demands placed upon them.  Author: Axel Stoermann, Toshiba Memory Europe 

At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.

Toshiba has started sampling the 128GB version of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtua...