At Embedded World 2013 Toshiba Electronics Europe will launch new devices and development tools designed to simplify and speed embedded motor control implementations in industrial control and home appliance applications. Visitors will also be able to see microcontrollers dedicated to reducing the component count of domestic, commercial and industrial smart metering applications.

Toshiba today announced that the company will start sales of white light-emitting diode packages that offer makers of general purpose and industrial LED lighting solutions a cost-competitive alternative to current LED packages. Mass production will start this month. Production of LED chips is typically done on 2- to 4-inch wafers with an expensive sapphire substrate.

Toshiba has announced a free positioning wireless charging chipset consisting of a high-efficiency power transmitter and receiver for charging smartphones and other mobile products anywhere on the battery charging pad. The Toshiba chipset is fully compliant with the Wireless Power Consortium Qi interface specification, A4, A8, A12 and A14. It includes the TB6865FG power transmitter and TB6860WBG receiver and features a two-coil control architectu...

Toshiba have announced that Toshiba and Toshiba T&D Europe have won an Engineering, Procurement and Construction contract for a High Voltage and Direct Current power conversion system for an undersea power transmission line between Cepagatti, Italy, and Kotor, Montenegro. The project will deliver a maximum 1,000MW of power to Cepagatti and will contribute to the integration of the Southeastern Europe and EU power grids.

Toshiba has launched a low ON-resistance MOSFET, TPN2R503NC, fabricated with the latest 8th generation process, for use in lithium-ion battery protection circuits and mobile phone power management switches. Two other 8th-generation products, TPN4R203NC and TPN6R303NC, have also been added to the line-up as successors to existing models. All three products can contribute to the reduction of device thickness and overall size and improve efficiency.

Toshiba Electronics Europe (TEE) has developed a CMOS image sensor dedicated to meeting the specific performance, quality and long-term operational demands of automotive and surveillance camera applications.

Toshiba has created and is distributing an application that simplifies and enhances wireless data transfers between smartphones and FlashAir, the SDHC memory card with embedded wireless LAN functionality. The app, FlashAir, is currently available free of charge for Android devices through Google Play and an iOS version is scheduled for launch in spring next year.

Toshiba have launched the T4K37, a 13 mega pixel, 1.12 micrometre, CMOS image sensor delivering high-image quality equivalent to a 1.4 micrometre pixel image sensor. Toshiba implemented back side illumination (BSI) technology and integrated colour noise reduction (CNR) to develop its newest CMOS image sensor that fits into an 8.5mm x 8.5mm size camera module and enables high-quality pictures even in low-light conditions.

Toshiba Electronics Europe (TEE) has revealed a new security module for automotive microcontrollers, which meets advanced industry standards aimed at protecting vehicle electronics against hacking, tampering and software IP theft.

Toshiba Electronics Europe has announced a sixth generation IGBT technology that offers improved switching loss/conduction loss trade off for increased efficiency and improved performance. The new technology is the basis for a new family of compact 600V devices that will suit a variety of hard switching applications including motor drives, solar inverters and uninterruptible power supplies.

Toshiba America Electronic Component, Inc. today announced its Li-ion battery monitor chipset for automotive applications. The chipset includes the industry's first1 battery monitor IC capable of checking up to 16 cells per one IC, which simplifies design and lowers costs by reducing the number of components required in an automotive battery monitoring system. The new Toshiba chipset is ideal for Hybrid Electric Vehicles (HEV) and Electric Vehicl...

Toshiba Electronics Europe (TEE) has launched a new Photocouplers and Photorelays guide that is set to become an essential reference for engineers looking to build galvanic isolation and noise protection into their applications.

Toshiba Electronics Europe (TEE) has announced availability of two extended temperature SMT photocouplers* that will reduce component count and save board space in high component density industrial equipment. Target applications will range from programmable logic controllers (PLCs) and switching power supplies to inverters and servo amplifiers for factory automation systems.

Le dernier-né de la série de microcontrôleurs 32 bits ARM Cortex-M3 de Toshiba Electronics Europe (TEE) réduira le nombre de composants externes dans les applications grand public et industrielles dont la conception exige haute performance, basse consommation et fonction USB.

The latest 32-bit ARM Cortex-M3 microcontroller from Toshiba Electronics Europe will reduce the component count of industrial and digital consumer applications where high performance, low power and USB functionality are key design requirements.

Toshiba Electronics Europe has announced three new additions to its portfolio of solutions supporting the TransferJet close proximity wireless technology transfer standard.

The TC358768 parallel-to-DSI bridge from Toshiba Electronics Europe (TEE) simplifies upgrading of displays in devices such as smartphones, media players and industrial instrumentation to deliver enhanced resolution and colour depth.

Toshiba today announced that it will launch two 2.5-inch form factor Hybrid Drives that bring new levels of high speed read and write performance to notebook and desktop PCs. The new drives, which integrate high capacity hard disk drives and NAND flash memory in a single unit, will be available in two capacities, 1 terabyte*1 and 750 gigabytes*1. Sample shipments started today.

Toshiba has announced a series of low ON-resistance MOSFETs in the new high-performance UDFN6 package. This compact 2x2mm2 LGA package with power dissipation levels of 1Watt enables the combination of high current operation with small footprint that is increasingly demanded in mobile applications. With the features and functionalities added to current handheld devices, battery lifetime and recharging time are of increasing interest.

Toshiba, Kobe Steel and Keio University have today jointly announced that they have been selected by Japan's Ministry of Environment to develop and verify a hybrid power control system for concentrated solar power, wind turbine and biomass binary power generation.