The TPSI2140-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2140-Q1 uses TI's high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply. The entire primary side of the device requires only 9 mA of input current, enabling the user to drive both the VDD and EN pins ...

The IWR6x43 device is an integrated single chip mmWave sensor based on FMCW radar technology capable of operation in the 60-GHz to 64-GHz band. It is built with TI’s low power 45-nm RFCMOS process and enables unprecedented levels of integration in an extremely small form factor. This device is an ideal solution for low power, self-monitored, ultra-accurate radar systems in the industrial space. Multiple variants are currently available incl...

Texas Instruments has announced that LITEON Technology has selected TI’s highly integrated gallium nitride (GaN) field effect transistor (FET) plus C2000TM real-time microcontrollers (MCUs) for its latest server power supply unit (PSU) for the North American market.

Designers of ultra-low-power electronics today make constant trade-offs between higher performance and longer battery life. Despite improved battery capacities, the fundamental challenge remains: How do we achieve higher performance for longer periods of time?

The BQ79631 Evaluation Module user's guide describes the safety considerations, general features, theory of operation, hardware setup, and use of the BQ79631 EVM. Throughout this user's guide, the abbreviations BMS039, EVM, and the term evaluation module are synonymous with the BQ79631EVM unless otherwise noted. This EVM is an evaluation board for the BQ79631-Q1 to provide monitoring, protecting, and communications in high voltage environments wi...

This reference design uses our nano-power system timer, SimpleLink™ ultra-low power wireless microcontroller (MCU) platform and humidity sensing technologies to demonstrate an ultra-low power method to duty-cycle sensor end nodes. These technologies lead to an extremely long battery life of over 10 years with a standard CR2032 lithium-ion coin-cell battery. The design includes techniques for system design, detailed test results an...

Texas Instruments (TI) will showcase technologies that are “Advancing Intelligence and Electrification” at embedded world 2023, 14th-16th March in Nuremberg, Germany. TI experts will demonstrate embedded processing and electrification innovations including new Arm Cortex-based microcontrollers (MCUs) and processors, as well as other embedded technologies in applications for advanced driver assistance systems (ADAS), robotics and ...

TPS281C30x is a single channel smart high-side switch designed to meet the requirements of industrial control systems. The low RON(30 mΩ) minimizes device power dissipation, driving a wide range of output load current up to 6-A DC and the64-V DC tolerance improves system robustness. The device integrates protection features such as thermal shut down, output clamp, and current limit. These features improve system robustness during fault eve...

This LaunchPad™ is used to speed development with the SimpleLink™ Multi-Standard CC2652R7 wireless MCU with support for Bluetooth®, Zigbee® and Thread.  Software support is provided by the SimpleLink CC13XX-CC26XX software development kit (SDK).

The LMG342xR030 GaN FET with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG342xR030 integrates a silicon driver that enables switching speed up to 150 V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI’s low-inductance package, delivers cle...

The SimpleLink™ CC13xx and CC26xx software development kit (SDK) provides a comprehensive software package for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, proprietary, and multiprotocol solutions on the SimpleLink CC13xx and CC26xx wireless MCUs.

Texas Instruments (TI) has announced plans to build its next 300mm semiconductor wafer fabrication plant (or fab) in Lehi, Utah.

The BQ25628 and BQ25629 are highly-integrated 2-A switch-mode battery charge management and system power path management devices for single cell Li-ion and Li-polymer batteries. The solution is highly integrated with built-in current sensing, loop compensation, input reverse-blocking FET (RBFET, Q1), high-side switching FET (HSFET, Q2), low-side switching FET (LSFET, Q3), and battery FET (BATFET, Q4) between system and battery. 

The SimpleLink™CC2652R device is a multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication ...

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm® Cortex® M4F main processor and optimize...

The SimpleLink™ Wi-Fi® CC3235SF dual-band LaunchPad™ development kit (LAUNCHXL-CC3235SF) highlights CC3235SF, a single-chip security solution and wireless microcontroller (MCU) which integrates a user application dedicated ARM® cortex®-M4 MCU and a network processor that runs 2.4GHz and 5GHz Wi-Fi, internet, and security protocols. The LAUNCHXL-CC3235SF features on-board emulation and sensors for a full out-of-the-box expe...

The TPS1641x is an integrated eFuse with accurate power limit or current limit. The device provides robust protection with integrated overcurrent protection, overvoltage protection, IN to OUT short detection and overtemperature protection. TPS16410 and TPS16411 devices provide ±5% power limiting at 15 W for loads and it also provides configurable blanking time for transient overload or overcurrent events.

Selecting the right wireless connectivity technology is a critical design decision from the beginning. This determines the protocol interoperability, distance, robustness and the use-cases for your application. This selection guide will walk you through several key decision requirements starting with the table below as a high-level summary of various wireless connectivity technologies

The TPSM831D31 is a PMBus™-controlled, dual-output, 4-phase power module that combines a high-performance D-CAP+™ controller with four high-efficiency Smart Power Stages, and low-loss inductors, into a rugged, thermally enhanced surface-mount package. The user supplies the input and output capacitors and a few passive components to complete the system. The first output is a 3-phase power stage that can deliver up to 120 A of continuou...

The TPS25982 family of eFuses is a highly integrated circuit protection and power management solution in a small package. The devices are operational over a wide input voltage range. A single part caters to low-voltage systems needing minimal I*R voltage drop as well as higher voltage, high current systems needing low power dissipation. They are a robust defense against overloads, short-circuits, voltage surges and excessive inrush current.