AM62Ax is an extension of the Sitara™ automotive-grade family of heterogeneous Arm® processors with embedded Deep Learning (DL), Video and Vision Processing acceleration, display interface and extensive automotive peripheral and networking options. AM62Ax is built for a set of cost-sensitive automotive applications including driver and in-cabin monitoring systems, next generation of eMirror system, as well as a broad set of industrial a...

The TPD1E01B04-Q1 is a bidirectional TVS ESD protection diode for USB Type-C and FPD-Link circuit protection. The TPD1E01B04-Q1 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

Driver monitoring can detect driver and passenger state and behavior to provide information that can help make the driving experience safer. Smart Eye's algorithms and software running on AM62A vision processors provides an innovative interior sensing solution.

This user's guide can be used as a guide for integrating the TPS6594-Q1 power management integrated circuit (PMIC) into a system powering the Automotive Jacinto J784S4 or J721S2 processors with isolated MCU and Core power groups.

Do you want to bring your satellite communication payload design for programs to the next level? Learn how to benefit from TI’s latest innovations and quality levels for easy adjustments of your platform for different mission profiles and cost targets for satellite communication programs such as IRIS 2

The AM69 scalable processor family is based on the evolutionary Jacinto 7 architecture, targeted at Smart Vision Camera applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the Vision processor market.

The TCA9539-Q1 is a 24-pin device that provides 16 bits of general purpose parallel input and output (I/O) expansion for the two-line bidirectional I2C bus (or SMBus protocol). The device can operate with a power supply voltage (VCC) range from 1.65 V to 3.6 V. 

The SimpleLink CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee, Matter, Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver.

In electric vehicle (EV) charging and solar inverter systems, current sensors measure current flow by monitoring the voltage drop across a shunt resistor or the magnetic fields generated by current flowing through a conductor. These high-voltage systems use current flow information to control and monitor power conversion, charging and discharging.

While integrated shunt products are not new, what is new is bringing the benefits of simplicity, low drift, small size and cost together. TI’s EZShunt technology removes the need for an external shunt resistor by using the leadframe in the package itself to behave as the shunt.

The SK-AM62A-LP starter kit (SK) evaluation module (EVM) is built around our AM62A AI vision processor, which includes an image signal processor (ISP) supporting up to 5 MP at 60 fps, a 2 tera operations per second (TOPS) AI accelerator, a quad-core 64-bit Arm Cortex-A53 microprocessor, a single-core Arm Cortex-R5F and an H.264/H.265 video encode/decode.

The SK-AM62A-LP starter kit (SK) evaluation module (EVM) is built around our AM62A AI vision processor, which includes an image signal processor (ISP) supporting up to 5 MP at 60 fps, a 2 tera operations per second (TOPS) AI accelerator, a quad-core 64-bit Arm Cortex-A53 microprocessor, a single-core Arm Cortex-R5F and an H.264/H.265 video encode/decode.

The SK-AM62A-LP starter kit (SK) evaluation module (EVM) is built around our AM62A AI vision processor, which includes an image signal processor (ISP) supporting up to 5 MP at 60 fps, a 2 tera operations per second (TOPS) AI accelerator, a quad-core 64-bit Arm Cortex-A53 microprocessor, a single-core Arm Cortex-R5F and an H.264/H.265 video encode/decode.

This paper looks at the transition to software-defined vehicles and how moving to a zone electric/electronic (E/E) architecture addresses power distribution, sensor and actuator, and data communication challenges.

Do you want to bring your satellite communication payload design for programs to the next level? Learn how to benefit from TI’s latest innovations and quality levels for easy adjustments of your platform for different mission profiles and cost targets for satellite communication programs such as IRIS2. 

The TMS320F280015x (F280015x) is a member of the cost-optimized C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics.

The SimpleLink Wi-Fi CC3235SF dual-band LaunchPad development kit (LAUNCHXL-CC3235SF) highlights CC3235SF, a single-chip security solution and wireless microcontroller (MCU) which integrates a user application dedicated ARM cortex-M4 MCU and a network processor that runs 2.4GHz and 5GHz Wi-Fi, internet, and security protocols.

Selecting the right wireless connectivity technology is a critical design decision from the beginning. This determines the protocol interoperability, distance, robustness and the use-cases for your application. This selection guide will walk you through several key decision requirements starting with the table below as a high-level summary of various wireless connectivity technologies.

The LMG342xR030 GaN FET with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG342xR030 integrates a silicon driver that enables switching speed up to 150 V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. 

With the trendiness of the term “edge AI” or talk of “having more intelligence at the network edge,” it’s easy to lose sight of the benefits of having more local, real-time processing that doesn’t rely on cloud-based resources to run artificial intelligence (AI) models.