The LMR38020-Q1 synchronous buck converter is designed to regulate over a wide input voltage range, minimizing the need for external surge suppression components. The LMR38020-Q1 operates during input voltage dips as low as 4.2V, at nearly 100% duty cycle if needed, making the device an excellent choice for 48-V battery automotive applications and MHEV/EV systems.

The xWRL6432AOPEVM is an easy-to-use, low cost FR4-based evaluation board for the xWRL6432AOP mmWave sensing device, with standalone operation and direct connectivity to the DCA1000EVM for raw ADC capture and signal processing development. This EVM contains everything required to start developing software for on-chip hardware accelerator and low power ARM Cortex M4F processor.

Texas Instruments (TI) has debuted new power-management chips to support the rapidly growing power needs of modern data centres.

The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments’ modern, high-performance, analog wafer process. A high quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s).

In modern electric vehicles (EVs) and hybrid electric vehicles (HEVs), the battery management system (BMS) serves as the brain of the battery pack, responsible for ensuring battery performance, safety and longevity. The BMS monitors parameters such as state of charge, which provides insight into the remaining energy available, and state of health, which assesses the overall condition and aging of the battery cells. These metrics help maintain eff...

At embedded world 2025, Electronic Specifier's Managing Editor, Paige West, talks to Marian Kost Vice President and General Manager - Connectivity at Texas Instruments about the building blocks TI offer for IoT.

The DRV8300-Q1 from Texas Instruments is a 100-V three-phase gate driver designed to drive high-side and low-side N-channel MOSFETs in automotive systems. With 750mA source and 1.5A sink currents, it supports robust performance even under high-voltage transients.   Designed for BLDC motors, the DRV8300-Q1 reduces dead-time, increases efficiency, and offers undervoltage protection to ensure smooth, reliable operation in demanding automotive...

At embedded world 2025, on the DigiKey booth, Caitlin Gittins speaks with Artem Aginskiy, General Manager, General Microprocessors, Texas Instruments about TI’s product portfolio and how it's thinking about scalability and reusability.

Texas Instruments (TI) has introduced the world’s smallest MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimise board space in applications such as medical wearables and personal electronics, without compromising performance.

Struggling with EMI in 48V Automotive Systems? Texas Instruments breaks down how to reduce conducted EMI in buck converters—addressing the challenges posed by higher dv/dt and di/dt in modern 48V power rails.Discover proven techniques for mitigating EMI issues, including layout optimization, ferrite bead selection, and spread spectrum implementation.

The SimpleLink Bluetooth  low energy CC2640R2F-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting Bluetooth  4.2 and Bluetooth  5 low energy automotive applications such as Passive Entry/Passive Start (PEPS), remote keyless entry (RKE), car sharing, piloted parking, cable replacement, and smartphone connectivity.

MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 24MHz frequency.

This paper looks at the transition to software-defined vehicles and how moving to a zone electric/electronic (E/E) architecture addresses power distribution, sensor and actuator, and data communication challenges.

IWRL6432BOOST is an easy-to-use 60GHz mmWave sensor evaluation kit based on IWRL6432 device with on board FR4-based antenna. This board enables access to point-cloud data and power-over-USB interface. The IWRL6432BOOST supports direct connectivity to the DCA1000EVM development kit.

In this paper, we discuss the growing interest in 48V low-voltage rail systems for electric and hybrid vehicles and how engineers can use them to reduce wire harness size and cost while enabling new features.

The TIDM-02010 reference design is a 1.5-kW dual motor drive and PFC control reference design for variable frequency air conditioner outdoor unit controller in HVAC applications, which illustrates a method to implement sensorless 3-phase PMSM vector control for compressor and fan motor drive, and digital interleaved boost PFC for meeting new efficiency standards with a single C2000 microcontroller.

Real-time microcontrollers (MCU) play a crucial role in helping high-voltage automotive and energy infrastructure systems meet power efficiency, power density, and safety design requirements. From onboard chargers (OBC) to uninterruptible power supplies (UPS), these devices must deliver fast, deterministic performance for timecritical tasks in harsh environments.

It’s been challenging over the course of human history to understand the ripple effect caused by environmental events. How did frost in a pine forest followed by a storm front bringing heavy rain lead to a sudden influx of silt in a harbor hundreds of miles away?

The F29H85x and F29P58x are members of the C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of GaN and SiC technologies.

The F29H85x and F29P58x are members of the C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of GaN and SiC technologies.