The Bluetooth Special Interest Group (SIG) announced that Haipeng Jin, co-founder of Telink Semiconductor in Shanghai, has joined the board of directors of the Bluetooth SIG as an Associate Member Director to serve a two-year term starting in July 2019.

Telink Semiconductor has announced that it is releasing an updated version of its Bluetooth Low Energy (BLE) software development kit (SDK) for Apple HomeKit. This means that any Apple HomeKit licensees can use Telink Semiconductor’s SDK to develop products and accessories, based on a single chip solution that features built-in security key authentication.

  Telink Semiconductor has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK to its customers.

Developer of highly integrated low power chips for Internet of Things (IoT) applications, Telink Semiconductor, and IXYS Corporation, a manufacturer of power semiconductors, have signed an agreement to jointly target the growing IoT market. 

Telink Semiconductor's Bluetooth mesh technology is being used in connected LED light bulbs from GE Lighting, in its C by GE product family. This smart product is enabled by Telink’s proprietary BLE mesh technology, which can uniquely update in real-time and reflect multiple nodes’ status automatically using Telink’s patented network traffic control technology.