Looking to strengthen its grip on leadership in the industrial microcontrollers market, STMicroelectronics (ST) has introduced its new performance-oriented STM32H5 microcontroller (MCU) series.

STMicroelectronics (ST) enjoyed a 100% sales increase in its microprocessor (MPU) sales in 2022 and is looking to follow up that success with the STM32MP13.

With micro-power current consumption and 150°C operating-temperature capability, STMicroelectronics’ TSU111H 5V automotive operational amplifier delivers a combination of properties that are unusual to find in one device.

STMicroelectronics’ STM32WBA52 microcontrollers (MCUs) combine Bluetooth LE 5.3 connectivity with ultra-low-power modes, advanced security, and a broad selection of peripherals familiar to STM32 developers.

STMicroelectronics is enabling the next generation of smart devices for secure, safe, and sustainable living with its latest STM32 microprocessors (MPUs).

STMicroelectronics’ LSM6DSV16BX is a unique highly integrated sensor that delivers tremendous space savings inside hearable devices including sports and general-purpose earbuds. It combines a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

STMicroelectronics, a global semiconductor specialist serving customers across the spectrum of electronics applications, has achieved USB-IF (USB Implementers Forum) certification of two ICs for use in adapter (source) and device (sink) sides of a USB Power Delivery (USB PD) EPR1 power supply/charger product.

STMicroelectronics has introduced the ST-ONEHP integrated digital controller, the world’s first IC certified by USB-IF according to the USB Power Delivery Extended Power Range (USB PD 3.1 EPR) specification.

STMicroelectronics’ ST87M01 compact and low-power modules combine reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets.

STMicroelectronics has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance while squeezing power consumption for longer runtimes and energy efficiency. The STM32U5 has also received NIST embedded random-number entropy source certification1; the industry’s first to receive this endorsement.

STMicroelectronics has been named a ‘Top 100 Global Innovators’ 2023.

STMicroelectronics has expanded its family of advanced ultrasound transmitters by adding a 32-channel variant with high output current for portable applications.

STMicroelectronics has released single-, double-, and four-channel automotive high-side gate drivers in a common PowerSSO-16 package style, with pin assignments that simplify scaling circuit designs to add more driver channels.

Gridspertise and STMicroelectronics (ST) have announced in occasion of DistribuTECH 2023 that they have entered a new phase of their long-term collaboration on smart-meter technologies.

STMicroelectronics’ HVLED101 90-400V flyback controller for LED-lighting applications up to 180W enhances performance and simplifies design through extensive feature integration, patented control techniques, and support for primary-sensing regulation.

STMicroelectronics is extending its integrated and power-saving ST-ONE family of USB Power Delivery (USB-PD) digital controllers by introducing the ST-ONEMP, which supports two power outputs.  

STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimised for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers.

STMicroelectronics is again broadening access to its STM32 microcontroller (MCU) family by introducing the most affordable series yet: the STM32C0.

STMicroelectronics is broadening access to its STM32 microcontroller (MCU) family by introducing the most affordable series yet: the STM32C0.

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.