Paige West speaks with Frank Heidemann, Founder, SET GmbH about the changes we’re seeing in the semiconductor industry and what this means for testing and qualification.

With the continuously rising demands on mobility and autonomous driving, integrated and automated testing solutions are needed for Advanced Driver Assistance Systems (ADAS). The combination of ADAS sensor fusion with a Hardware in the Loop (HiL) testing system is necessary to enable a new level of innovative, automated testing solutions in the automotive space.

SET, Smart Equipment Technology, has announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.