Since thermal management is critical to heat sink performance, testing with Thermex temperature distribution film has become a useful design and assembly quality control check. Thermex®, from Sensor Products Inc, is an economical thin sensor film that can be used in virtually any application to test and monitor heated contacting surfaces from 200° to 300°F (93° to 149°C). It can be used alone or in conjunction with Fuji Prescale® pressure ...

Heat sinks need to efficiently conduct heat away from the electronic components that generate this heat. The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound ef...

To spur research and development efforts, Sensor Products Inc. is offering a 10% discount on its versatile Pressurex® pressure-indicating sensor film during this summer. Over the past decade, hundreds of White Papers have been written using the sensor film. Pressurex ® measures surface contact pressures between 2 -- 43,200 PSI (0.14 – 3,000 g/cm2). The 10% discount is available to researchers until November 30, 2010. To receive the discount,...

Ultrasonic Welding (USW) is a joining technique that uses high-frequency ultrasonic acoustic vibrations to create solid-state welds. In the electronic, computer and electrical industries, ultrasonic welding is often used to join wired connections and to create connections in small, delicate circuits. Junctions of wire harnesses are often joined using ultrasonic welding. Electric motors, field coils, transformers and capacitors may also be assembl...

Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding pressure across a flip chip die assures chip to substrate coplanarity, optimal bump compression, and a controlled, reproducible die to substrate gap. Pressurex pressure indicating sensor film is a valuable assist to today’s flip chip bonders which l...

Pressurex film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations in the lamination of dry film resist to the board substrate. When placed between nip rollers in the lamination press, the film instantaneously and permanently changes color directly proportional to the actual pressure applied.

Pressurex surface pressure indicaing film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process. When placed between contacting surfaces, it instantaneously and permanently changes color directly proportional to the actual pressure applied. With Pressurex®, variations in pressure that lead to imperfections (or irregularities) in...

SB Electronics designs and manufactures film capacitor products for today’s demanding electronics applications. To maintain continuous improvement of its manufacturing processes, David Bryan, Manufacturing Engineering Manager for SB Electronics, recently specified Pressurex, a tactile surface pressure-indicating film from Sensor Products Inc.