Companies

Schroff UK Ltd

  • Unit 4, Grovelands Business Centre Hemel Hempstead, Hertfordshire
    HP2 7TE
    United Kingdom
  • +44 (0) 1442 24 04 71
  • http://www.schroff.co.uk
  • 01442 213508

Schroff UK Ltd Articles

Displaying 101 - 119 of 119
Power
31st October 2007
Modular power system offers UPS and hot-swap capabilities

New from Schroff is the modular Power System 1400, which provides all the functionality required for today’s high-reliability datacomms and telecomms applications. Designed to accommodate up to eight 200W plug-in PSUs in a 3U-high 19in. enclosure, the PS1400 can be configured as an n+1 redundant system with hot-swap capability and offers a battery backup facility for operation in UPS mode. The system provides a total of 21 individually fuse...

Enclosures
4th October 2007
Schroff's 1200mm-deep server cabinets offer ample space for cabling

Schroff has expanded its Varistar Server range of cabinets with a new series of 1200mm-deep models that have been designed to provide ample space for both front and rear cabling. Capable of accommodating servers from all leading manufacturers, the cabinets offer a spacing of 740mm between front and rear panel mounts, with a 120mm gap at the front for patch cables and a 340mm gap at the rear for power and data cables.

Enclosures
17th September 2007
VME64x system for use in tough environments

Schroff has introduced a new 12-slot VME64x system that is aimed at applications in demanding environments where the use of COTS equipment is becoming more prevalent, particularly in the transportation and military sectors. Designed to accommodate 6U-high boards vertically in a 7U-high 19in. shielded subrack, the new system provides 12 front slots for 160mm-deep boards, as well as three rear slots for 4HP transition modules.

Power
29th August 2007
Plug-in PSU offers high power density without fan cooling

The latest addition to Schroff’s ecopower range of AC/DC switch-mode regulators is a compact 200W plug-in unit that takes up just half the width of a conventional power supply of this performance level and yet is able to achieve an efficiency of 90% using only convection cooling. Particularly aimed at datacom and telecom applications, the new SEC148-200 power supply provides a main output of 48V, together with a battery-charging output of 56V.

Enclosures
24th July 2007
New open-frame rack for audio-visual and broadcast applications

Schroff has introduced a new version of its popular Minirack 19in. cabinet to meet the requirements of users in the audio-visual and broadcast (AVB) industries. Featuring an attractive design finished in RAL 7021 black, the AVB Minirack is supplied as an open-frame unit to allow quick and easy access to equipment and cabling.

Enclosures
10th July 2007
AdvancedTCA systems allow horizontal mounting of boards

Schroff has expanded its portfolio of AdvancedTCA products with a new range of compact 2- to 5-slot systems designed to allow modules to be mounted horizontally. Aimed at both the development environment and enterprise solutions, the new range of AdvancedTCA systems incorporates hot-swap capable fan units with a cooling performance of 200W per front board and 15W for the rear I/O area, while an independent fan controller enables the systems to be...

Enclosures
20th June 2007
Compact desktop case has integrated ventilation facility

The new ratiopacPRO-air compact case from Schroff has been designed to provide a robust, EMC-shielded enclosure that is particularly well suited to applications in the instrumentation sector. Featuring ventilation slots on either side of the card cage, the case ensures optimum airflow over plug-in units to aid the thermal management of high-density electronics.

Enclosures
21st May 2007
Brochure highlights AdvancedTCA, AdvancedMC and MicroTCA technology

Schroff UK has brought out a new brochure outlining the company’s extensive range of electronics packaging solutions for systems based on the emerging AdvancedTCA, AdvancedMC and MicroTCA specifications.

Design
14th May 2007
Development system provides easy way of evaluating MicroTCA technology

Schroff UK has launched a new development system designed to provide engineers with a quick and easy way of evaluating MicroTCA technology. The MicroTCA specification, which allows AdvancedMC modules to be plugged directly into a backplane without the need for a carrier, is rapidly emerging as a key architecture for telecoms network systems and is also attracting other market sectors such as industrial automation, image processing, medical equipm...

Enclosures
16th April 2007
Catalogue features datacom, server and cabling cabinets

Schroff UK has brought out a new catalogue outlining its comprehensive range of cabinets, wall-mounted enclosures and accessories for use in datacom and networking applications.

Enclosures
10th April 2007
Desk-top case for T&M applications

Schroff UK has introduced a new version of its popular propac systems case. Known as propacPRO, it is particularly suitable for test and measurement applications and can be configured for use as a desk-top or portable case, accommodating 19in. or non-standard components and plug-in units. As well as featuring an updated design, propacPRO offers excellent RFI shielding for the protection of sensitive electronics and incorporates four ventilation ...

Analysis
27th March 2007
One-day conference will look at AdvancedTCA and MicroTCA architecture standards

Schroff UK and a number of other key organisations involved in the development of the emerging AdvancedTCA and MicroTCA open computing specifications are sponsoring a one-day technical conference on 25th April 2007 at the RBS Williams Formula 1 conference centre in Oxfordshire.

Enclosures
16th March 2007
MicroTCA subracks include backplane and shielding

Schroff has introduced a new family of subracks specifically designed for applications based on the emerging MicroTCA specification. As well as incorporating full RFI shielding, the subracks are equipped with a MicroTCA backplane providing eight full-size AdvancedMC slots, four compact AdvancedMC slots, two MCH slots and two power-module slots. Available in 3U height for single AdvancedMC modules or 4U for double AdvancedMC modules, the subrac...

Enclosures
15th January 2007
Desktop cases from Schroff are pre-configured for PXI instrumentation

Schroff has introduced a new series of desktop cases that are supplied fully configured for use in PXI-based test and measurement applications. Using the proven technology of Schroff’s ratiopacPRO case, the new PXI complete systems are available in a choice of four versions designed to accommodate 8, 14, 18 or 21 PXI boards.

Enclosures
22nd June 2006
Hybrid backplane eases migration to CompactPCI Express

Schroff has introduced a new hybrid backplane that has been designed to facilitate the transition from CompactPCI to the new CompactPCI Express standard by combining the two bus architectures on to a single backplane.

Enclosures
13th June 2006
Complete PICMG Micro TCA Systems from Schroff

Schroff has introduced a range of complete systems to meet the requirements of the PICMG MicroTCA standard, which defines a system architecture that allows AdvancedMC mezzanine boards to be plugged directly into a backplane without a carrier board.

Enclosures
7th June 2006
COMPREHENSIVE NEW ENCLOSURES CATALOGUE FROM SCHROFF

Schroff has announced the availability of a new edition of its comprehensive Electronics Packaging catalogue. With more than 850 pages, Edition 22 provides an indispensable source of information for anyone involved in specifying or purchasing electronics enclosures or related products and services.

Enclosures
16th May 2006
VME64x Tower Cases suit T&M Systems

Schroff has expanded its range of VME64x system cases with the introduction of two new tower versions suitable for use in test and measurement applications.

Enclosures
12th May 2006
Systems Integration Service Cuts Cost and Time

Schroff has expanded its system integration facilities to provide a comprehensive service aimed at customers who are looking to reduce overheads and product development times by outsourcing some or all of their design and manufacturing activities.

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