Today’s computer chips have advanced significantly from 130 transistors per device in the 1970s to 208 billion in 2024 in Nvidia's latest Grace Blackwell GB200 chip.

Due to the complexity of growing quality silicon carbide (SiC) crystals, manufacturers need help obtaining sufficient systems to meet global production targets

PVA has announced its partnership with Torenko & Associates as its manufacturers’ representative in the states of Texas and Oklahoma.

Whether bonding metal to plastic, silicon to glass, polymers to other polymers of different durometers, biological content to polymeric microtiter plates or even bonding to PTFE, plasma can be used to promote adhesion. This according to Michael Barden of PVA TePla, a company that designs and manufactures plasma systems.

Exposure to water, dust, oil, chemicals, movement and extreme temperature changes can damage circuitry. This problem is exacerbated for multi-component printed circuit boards (PCBs) found in outdoor devices that must withstand a wide range of weather conditions for decades with little or no degradation in performance.