High speed data transmission and requirements for low latency demand implementations of narrow RF multi-channel designs and low interference with coexisting bands, in accordance with Wi-Fi 6E and Wi-Fi 7 / IEEE802.11ax standards.

Ultrasonic-based Scanning Acoustic Microscopy (SAM) has long been the method of choice for quality testing and failure analysis of silicon ingots, wafers, integrated circuits, and MEMS. Ultrasound can locate voids and disbonds between material layers better than other non-destructive methods because sound waves can look inside the layers to detect the thinnest of air gaps and delaminations down to a hundredth of a micron.