Provider of embedded computing and enclosure solutions, Pixus Technologies has released a new OpenVPX backplane with 1 VPX slot and 1 VITA 62 slot for a pluggable power supply. 

Pixus Technologies has several sizes for its ventilated panels for electronics enclosures. The panels fit the company’s modular Rittal Vario and RiCase aluminum cases. The ventilation panels allow airflow in Pixus’ instrumentation cases. Customers can mix-and-match ventilated and non-ventilated panels on the front or rear of the enclosure. The panels come in 84HP and 42HP size for 19” and 9.5” enclosures respectively....

  Provider of embedded computing and enclosure solutions, Pixus Technologies has released a new 3U OpenVPX high speed backplane in the 6-slot size. 

  Provider of embedded computing and enclosure solutions, Pixus Technologies, now offers protective solder-side covers for 3U and 6U Eurocard PCBs. The covers come in version that mount to OpenVPX, CompactPCI, and VME/64x boards.

Provider of embedded computing and enclosure solutions, Pixus Technologies, now offers an ejector/injector handle for very high insertion force systems. The long ergonomic handle is suitable for 6U OpenVPX applications. The Pixus high insertion force Type VII design can handle up to 815N of pressure and features a die-cast zinc all-metal design. It can be used on standard panels or with an 1/2 HP offset for OpenVPX systems.

  Pixus Technologies now offers a development enclosure for 3, 6U, or custom sized boards with sidewalls that can be removed. This feature allows a system to be enclosed for thermal testing and the walls to be taken out for ease of access to boards inside the chassis.  

Provider of embedded computing and enclosure solutions, Pixus Technologies, offers specialty extruded rails and other components for electronic enclosure subracks. The Pixus subrack components include front, rear and centre rails for the modular attachment of card guides or DIN-type connectors in all types of configurations.

  Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced that it's 1U MicroTCA Chassis has new versatile power options.

Card guides for conduction cooled modules are now being offered from Pixus Technologies, which can be used in standard IEEE air-cooled enclosures. The card guides facilitate plugging of conduction-cooled modules into a backplane for testing and development. 

  Provider of embedded computing and enclosure solutions, Pixus Technologies, is now offering modular subracks and components for plugging of various sized boards. The subracks are commonly 3 and 6U high or 4 and 7U allowing for spacing for fans. 

A supplier of backplane, chassis, and embedded component solutions, Pixus Technologies, now offers a 4U high chassis for the development of 3U VPX and OpenVPX cards. The VPXD4500 OpenVPX Development Chassis features a 5-slot OpenVPX backplane with a BKP3-DIS05-15.2.13-n profile per the VITA 65 specification.

  Provider of embedded computing and enclosure solutions, Pixus Technologies, offers shelf managers that comply to VITA 46.11 for shelf management of OpenVPX systems. There are also configurations for use in legacy VME/64x and CompactPCI systems. 

Pixus Technologies has upgraded its 1U MicroTCA enclosure system to PCIe Gen 3. The company will continue to upgrade its various configurations of MicroTCA solutions to the higher-speed standard. The Pixus PXS0108 MicroTCA chassis platform features 6 AMC slots and 1 MCH slot. Various power options are available, including a dual redundant configuration.

Pixus Technologies has announced conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs. Enclosures formats are available for both OpenVPX and MicroTCA architectures. The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards.

Pixus Technologies, a provider of embedded computing and enclosure solutions, has made several upgrades to its latest generation of AdvancedTCA (ATCA) enclosure system. The changes include a 40GbE backplane, shelf manager and Power Entry Module (PEM) options.

Providing the modular framework for electronics enclosures, Pixus Technologies now offers double rail extrusions with dual mounting. The Pixus double rails feature mounting holes for a second screw, providing more stability and strength for a modular enclosure. The rails have been tested and used in German railway applications for high resistance to shock/vibration and the ability to handle extreme loads.

Pixus Technologies now offers several standard profile configurations for OpenVPX backplanes. The boards are compliant to the VITA 65 specification. Pixus has greatly expanded its OpenVPX enclosure offering along with new backplane configurations. The company has new 3U backplanes in 5, 9, and 18 slots and new 6U versions in 2 and 5 slots.

Pixus Technologies now offers a 15U AdvancedTCA (ATCA) chassis that exceeds 400W/slot cooling capability and meets stringent NEBS requirements. While others in the industry have boasted 400W/slot cooling, NEBS compliance and the CPTA best practices are often ignored.

Pixus announces its VITA 62 Power Interface Boards (PIBs), which come in 3 and 6U heights in either single PSU or dual PSU formats. They have a header for the voltage sense and IPMB for VITA 46.11 system management or other IPMI-based options.  

  Pixus Technologies now offers customised versions of the Rittal brand Instrument Cases and Enclosures. This includes the three case families which serve the Mil/Aero, Communications, Industrial Control, Energy, Transportation, Test/Measurement and Medical markets.