Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that its Palomar 3880-II Die Bonder was recognized among the best by the 2022 Military + Aerospace Electronics Innovators Awards. An esteemed and experienced panel of judges from the aerospace and defense community recognised Palomar Technologies as a Gold honoree.

Palomar Technologies places palomar 9000 wedge bonder with bay photonics for advanced photonics applications. 

Palomar Technologies is offering a webinar that presents the challenges associated with semiconductor device packaging for 6G and quantum communications.

Palomar Technologies has announced they are offering a webinar discussing the differences between ball bonding and wedge bonding.

Palomar Technologies has announced they are offering a webinar on how to balance throughput and process control when manufacturing RF power amplifier assemblies.

Palomar Technologies and the Fraunhofer Institute for Integrated Systems and Device Technology IISB, have announced their joint research initiative in the area of high-quality, void-free power module packaging for electric vehicles.

Palomar Technologies has announced that since January, they have seen an increase in requests from customers manufacturing critical components needed to address the COVID-19 crisis. 

Palomar Technologies has announced it is partnering with the Electronics and Photonics Innovation Center (EPIC) to establish a Palomar Demonstration Laboratory. As part of the partnership, Palomar is investing $1m in equipment, including a fully loaded 3880 Die Bonder and an 8000i Ball / Bump Wire Bonder for use by customers at the EPIC facility in Paignton (Torbay), the heart of a vibrant electronics and photonics cluster in the United...

Total process solutions provider for advanced photonics, Palomar Technologies, has announced that SST Vacuum Reflow Systems, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a reliable solder connection with a better than industry standard void rate, a key to delivering high-reliability power modules for automotive and commercial applications. 

Palomar has announced it has expanded its Innovation Centre in Singapore to further meet the growing demands of photonics companies designing and launching new high performance packages that enable the IoT and 5G wireless networks. The expansion has provided the opportunity for Palomar to add their latest die bonder designed for the demanding assembly needs of advanced photonics packages - the 6532HP Die Bonder ...