At embedded world 2024, Greg Sheridan, Vice President of Strategy and Marketing at Octavo Systems, talks to Electronic Specifier's Editor, Mick Elliott, about the company and its new products.

Octavo Systems has announced the launch of its OSD32MP2 family, featuring two System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM.

Octavo Systems has announced a family of SiP devices based on the AMD Xilinx Zynq UltraScale+ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in- Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture.

Octavo Systems, an ST Authorised Partner, has expanded its support of the OSD32MP15x System in Package, the smallest available STMicroelectronics STM32MP1 module, with a production release at speeds up to 800MHz, and two new development boards.

Making a debut at embedded world in Nuremberg (February 26-28) is Octavo Systems’ OSD32MP1, a System-in-Package (SiP) product based on the STM32MP1 microprocessor from STMicroelectronics. The OSD32MP1 allows users of the STM32 family to move to Linux without adding size or complexity to their design.

Octavo Systems announced the most completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP. The OSD335x C-SiP integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block. The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing the 1GHz Arm Cortex-A8 Sitara AM335x processor from Texas Instruments, up to 1GB of DDR3 RAM,...

  Octavo Systems has announced a completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block.