NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service.

OnePlus has selected NXP’s QFN RF Front End Solution for WiFi 6 for its latest high-end flagship smartphone, the OnePlus 9 featuring WiFi 6. NXP’s highly integrated QFN Front End Solution for WiFi 6/6E. The QFN solution supports the latest WiFi 6 wireless network standard and supports new 6GHz spectrum.

NXP is a member of the Austin, Texas community, and currently employs approximately 4,000 people and operating two wafer fabrication (fab) semiconductor facilities located at opposite ends of Austin: Oak Hill and ATMC. On February 15th, many of our operations team members braved heavy snow and dangerous driving conditions to make their way to the facilities, which run 24 hours a day, 7 days a week to keep the supply of products flowing. By Steve...

NXP has announced its integrated Time-Sensitive Networking (TSN) solutions for industrial automation that now support the CC-Link IE TSN protocol, combining gigabit Ethernet bandwidth with TSN to strengthen time sharing communication, performance, security and functionality for industrial Ethernet.

NXP Semiconductors has introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s Common Criteria (CC) EAL 6+ certified EdgeLock SE050 secure element to protect IoT devices at the edge and securely connect them to one or multiple clouds and service providers.

The increasing strides made by technology are helping to advance our society in innumerable ways. Whether it is the tech being using at the coalface of vaccine development in the ongoing fight against the coronavirus pandemic, or the increasing drive towards autonomous vehicles within the automotive sector, technology is playing its part.

NXP Semiconductors has announced it is laying the foundation for a new era of WiFi 6 devices that can operate in the 6GHz band with its new CW641 WiFi 6E Tri-Band system-on-chip (SoC). With increasing congestion in the legacy 2.4GHz and 5GHz bands, the US FCC has approved 1.2GHz of unlicensed spectrum for the 6GHz band along with other regions around the world, which will transform the WiFi landscape.

NXP Semiconductors has announced BlueBox 3.0, a new and expanded version of NXP’s safe Automotive High-Performance Compute (AHPC) development platform. Designed for software application development and validation ahead of silicon device availability, BlueBox 3.0 now offers a flexible way to address user-defined vehicles, safety Level 2+ (L2+) automated driving, and the evolving vehicle architectures that will revolutionise connected vehicle...

The COVID-19 pandemic has had ramifications everywhere, for almost – if not all – the industries in the world. Contactless payment existed before coronavirus hit, but it worked alongside cash and chip-and-pin. However, the pandemic has seen a considerable increase in the amount of transactions using contactless payment. Because of this, biometric payment cards – significantly more secure than standard contactless cards – a...

NXP Semiconductors has announced a complete suite of new radar sensor solutions that can surround vehicles in a 360-degree safety cocoon and enable the identification and classification capabilities of imaging radar.

With the advancement of technology, Artificial Intelligence (AI) has started to become a tangible part of our everyday lives, assisting us with transportation, healthcare, protecting the environment and even helping us at home. In the coming decades, AI applications will go much further. Guest blog written by Lars Reger, NXP Semiconductors

NXP Semiconductors and Xiaomi have announced the new Xiaomi PonPon Tile 2.0 stickers, powered by NXP’s NTAG NFC chip technology. The PonPon stickers and Xiaomi’s Mijia (Mi Home) app work with a multitude of Xiaomi Mi smart home devices, such as lighting, security cameras, alarm clocks and entertainment systems. Configuring and managing the devices is all done with a simple tap of a Xiaomi NFC-enabled smartphone.

NXP Semiconductors has announced a strategic relationship with Amazon Web Services (AWS) focused on extending the opportunities of connected vehicles. The collaboration aims to deliver a secure, edge-to-cloud compute solution for next-generation vehicles that can enable new cloud-powered services to benefit carmakers, their business partners and consumers alike.

NXP Semiconductors has announced the LPC55S16 MCU has been awarded Level 2 certifications by both the PSA Certified scheme co-developed by Arm and the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP) using the secure protection profile for embedded processors. With fast-expanding IoT and Industrial edge applications, device security and data protection become paramount.

NXP Semiconductors has announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development. 

NXP Semiconductors has announced its latest NXP EdgeReady IoT solution for secure face recognition that enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add vision-based touchless access control.

In a keynote speech opening the NXP Connects developer conference, NXP CEO Kurt Sievers announced a collaboration with Volkswagen centred on the electronics for electric vehicles (EVs). Volkswagen has adopted NXP’s battery management system (BMS) into its innovative MEB platform to help increase vehicle range, extend battery longevity, and enhance safety.

NXP Semiconductors has announced that it is enhancing its machine learning development environment and product portfolio. Through an investment, NXP has established an exclusive, strategic partnership with Au-Zone Technologies to expand NXP’s eIQ Machine Learning (ML) software development environment with easy-to-use ML tools and expand its offering of silicon-optimised inference engines for Edge ML.

Following the introduction of mobile and automotive ultra-wideband (UWB) sensing solutions, NXP has expanded its portfolio to include new UWB ICs. Trimension SR040 and SR150 ICs are optimized to enable new IoT use cases such as smart locks and real-time location system (RTLS) tags, delivering ‘relative position’ with a very high level of accuracy.

NXP Semiconductors has announced that Volkswagen has adopted its Battery Management Solutions for the car maker’s MEB Electrical Vehicle Platform.