New NXP automotive wireless charging reference design is the first to be certified by the Wireless Power Consortium for the new Qi 1.3 standard

After remaining essentially unchanged for more than 25 years, the Subscriber Identity Modules (SIMs) used to authenticate devices onto cellular networks are undergoing a dramatic transformation, moving from physical hardware to downloadable software – embodied by the concept of eSIMs. Cyril Caillaud, NXP Semiconductors, explains.

NXP Semiconductors and MOTER Technologies have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more.

NXP Semiconductors has announced a milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, NXP has announced RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.

Like any emerging technology, the myths around UWB hit the headlines almost as fast as the facts, and sometimes linger on in our memories. We asked several UWB ecosystem players to weigh in on the misconceptions they see attending UWB now and in the future as the technology becomes more accessible. Let’s demystify four misunderstandings about UWB. Guest blog written by Peter Pirc, UWB Solution Manager at NXP.

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app expe...

NXP Semiconductors and TSMC has announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.

NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service.

OnePlus has selected NXP’s QFN RF Front End Solution for WiFi 6 for its latest high-end flagship smartphone, the OnePlus 9 featuring WiFi 6. NXP’s highly integrated QFN Front End Solution for WiFi 6/6E. The QFN solution supports the latest WiFi 6 wireless network standard and supports new 6GHz spectrum.

NXP is a member of the Austin, Texas community, and currently employs approximately 4,000 people and operating two wafer fabrication (fab) semiconductor facilities located at opposite ends of Austin: Oak Hill and ATMC. On February 15th, many of our operations team members braved heavy snow and dangerous driving conditions to make their way to the facilities, which run 24 hours a day, 7 days a week to keep the supply of products flowing. By Steve...

NXP has announced its integrated Time-Sensitive Networking (TSN) solutions for industrial automation that now support the CC-Link IE TSN protocol, combining gigabit Ethernet bandwidth with TSN to strengthen time sharing communication, performance, security and functionality for industrial Ethernet.

NXP Semiconductors has introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s Common Criteria (CC) EAL 6+ certified EdgeLock SE050 secure element to protect IoT devices at the edge and securely connect them to one or multiple clouds and service providers.

The increasing strides made by technology are helping to advance our society in innumerable ways. Whether it is the tech being using at the coalface of vaccine development in the ongoing fight against the coronavirus pandemic, or the increasing drive towards autonomous vehicles within the automotive sector, technology is playing its part.

NXP Semiconductors has announced it is laying the foundation for a new era of WiFi 6 devices that can operate in the 6GHz band with its new CW641 WiFi 6E Tri-Band system-on-chip (SoC). With increasing congestion in the legacy 2.4GHz and 5GHz bands, the US FCC has approved 1.2GHz of unlicensed spectrum for the 6GHz band along with other regions around the world, which will transform the WiFi landscape.

NXP Semiconductors has announced BlueBox 3.0, a new and expanded version of NXP’s safe Automotive High-Performance Compute (AHPC) development platform. Designed for software application development and validation ahead of silicon device availability, BlueBox 3.0 now offers a flexible way to address user-defined vehicles, safety Level 2+ (L2+) automated driving, and the evolving vehicle architectures that will revolutionise connected vehicle...

The COVID-19 pandemic has had ramifications everywhere, for almost – if not all – the industries in the world. Contactless payment existed before coronavirus hit, but it worked alongside cash and chip-and-pin. However, the pandemic has seen a considerable increase in the amount of transactions using contactless payment. Because of this, biometric payment cards – significantly more secure than standard contactless cards – a...

NXP Semiconductors has announced a complete suite of new radar sensor solutions that can surround vehicles in a 360-degree safety cocoon and enable the identification and classification capabilities of imaging radar.

With the advancement of technology, Artificial Intelligence (AI) has started to become a tangible part of our everyday lives, assisting us with transportation, healthcare, protecting the environment and even helping us at home. In the coming decades, AI applications will go much further. Guest blog written by Lars Reger, NXP Semiconductors

NXP Semiconductors and Xiaomi have announced the new Xiaomi PonPon Tile 2.0 stickers, powered by NXP’s NTAG NFC chip technology. The PonPon stickers and Xiaomi’s Mijia (Mi Home) app work with a multitude of Xiaomi Mi smart home devices, such as lighting, security cameras, alarm clocks and entertainment systems. Configuring and managing the devices is all done with a simple tap of a Xiaomi NFC-enabled smartphone.

NXP Semiconductors has announced a strategic relationship with Amazon Web Services (AWS) focused on extending the opportunities of connected vehicles. The collaboration aims to deliver a secure, edge-to-cloud compute solution for next-generation vehicles that can enable new cloud-powered services to benefit carmakers, their business partners and consumers alike.