NXP Semiconductors today announced that its Identification Business has reached a major milestone, having shipped over 500 million SmartMX security chips. Since the product launched in 2001, NXP‘s SmartMX chips have been incorporated into a wide variety of contact and contactless applications which require strong layers of security at the hardware and software level, including payment and bank cards, access management schemes, mass transit infr...

NXP Semiconductors today announced availability of the LPC1340 series microcontrollers with full-speed USB 2.0 device connectivity enabled by on-chip USB drivers certified by USB-IF, making them the easiest to use USB MCUs in the industry. The LPC1340 is supported by VDE IEC 60335 Class B test libraries to support customers in the Class B certification process. In addition, NXP will offer an easy-to-use, comprehensive development tool platform fo...

NXP Semiconductors today announced the launch of GreenChip TEA1733 - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W. Designed specifically for low-power computing and communication applications such as netbook adapters, printer adapter and LCD monitor supplies, the TEA1733 is a Switched Mode Power Supply (SMPS) controller IC that enables standby power levels less than 100mW. The GreenChip TEA173...

NXP Semiconductors today announced it has received the “Outstanding Performance Supplier” award from Sanmina-SCI Corporation (Nasdaq NM: SANM), a leading global Electronics Manufacturing Services (EMS) company.

NXP today announced the availability of its ARM® Cortex™-M0 based LPC1100 microcontroller family from distributors in December. NXP’s LPC1100 is the lowest-priced 32-bit MCU solution in the market, bringing higher value and ease of use than existing 8/16-bit microcontroller through unprecedented performance, simplicity, low power, and more importantly, dramatic reductions in code size for all 8/16-bit applications. With 15 members initially,...

NXP today announced that it has maintained the number one slot in ABI Research’s Contactless Transaction IC Vendor Matrix rankings. The survey examines the contactless semiconductor market for payment, ticketing and Near Field Communication (NFC) applications and ranks each of the vendors according their ability to innovate and implement the technology.

NXP Semiconductors today announced the release of the UJA107x family, its second generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. The UJA107x SBCs optimize the performance, power consumption and cost of electronic control units (ECUs) for a broad range of automotive applications, such as body control modules, climate control, seat control, electric power steering (EPS), adaptive lighting, rain/light sensors, parking assist...

NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the introduction of the SSL 2102 integrated dimmable mains LED driver IC for SSL retrofit lamps and modules; and the launch of its online design tool for SSL applications, which makes it easy for engineers to test the behavior of LE...

NXP Semiconductors today announced the extension of its management team with the appointments of Kurt Sievers as general manager for the automotive business and Frans Scheper as general manager for the standard products business. Both executives will report directly to President and CEO Rick Clemmer. The positions will enable NXP to further deliver on its strategy of building leadership in High Performance Mixed Signal (HPMS) technology, while ma...

NXP Semiconductors today announced third quarter sales of USD 1,034 million, a comparable increase of 19.2% and a nominal increase of 20.7% from the second quarter of 2009. While the effects of the economic and financial crisis continue to have an impact on the industry, the increase in sales on a sequential basis was visible across all business segments and regions.

Chip manufacturers Infineon Technologies AG and NXP Semiconductors Germany GmbH and chip card maker Giesecke & Devrient GmbH are among the eleven companies from six European Union countries participating in the European research project BioP@ss to develop a high-security chip card platform.

NXP Semiconductors today announced the availability of the UBA2028, a fully integrated high-voltage power IC that drives dimmable Compact Fluorescent Lamps. The UBA2028 enables lighting manufacturers to create high-quality CFLs that rival incandescent bulbs, with quick warm-up and unprecedented dimming capabilities down to 10 percent of full light intensity. The latest NXP CFL driver IC features the highest level of integration available on the m...

NXP today announced that its SmartMX security chip has been chosen by the Chinese government to power the country’s first ePassport scheme. Utilizing the latest developments in cryptography and security to protect the chip at both hardware and software level, NXP’s portfolio of SmartMX products enables data to be securely stored on the passport, creating an even stronger link between the document and its owner. The Chinese government will sta...

Cochlear Limited, Australian based leader in Implantable Hearing Solutions, and NXP Semiconductors, announced today that they have signed an agreement for the design and manufacturing of IC devices for Cochlear’s future generation Implantable Hearing devices.

NXP Semiconductors today announced that Audi of America will offer HD Radio, powered by NXP’s leading SAF3560 single chip solution, as standard on a range of 2011 Audi models. With the new NXP technology-based Harman Becker HD Radio, drivers and passengers of Audi models available from late 2010 will be able to experience digital broadcast with unprecedented high-quality sound.

NXP Semiconductors today announced that its SmartMX contact security chip has been chosen by the Egyptian government to power its Family Card – a welfare scheme which offers subsidies on goods such as food to low-income families. The joint project, which is run by the Ministry of Social Solidarity and the Ministry of Administrative Development, is working with card manufacturer Misr Security Systems, to introduce smart card technology to deploy...

NXP Semiconductors and Virage Logic Corporation today announced a strategic agreement that accelerates NXP’s move to high performance mixed signal leadership and further broadens Virage Logic’s extensive semiconductor IP portfolio. The agreement calls for the transfer of a part of NXP’s advanced CMOS intellectual property rights and certain engineering talent and equipment to Virage Logic.

Trident Microsystems and NXP Semiconductors today announced that they have signed a definitive agreement whereby Trident will acquire NXP’s television systems and set-top box business lines. Trident would remain fabless with a significant presence in Asia and as a result of the transaction would have a global leadership position in the digital home entertainment market. Under the terms of the transaction, NXP will receive newly issued shares of...

NXP Semiconductors today announced that its Sound Solutions business, headquartered in Vienna, Austria, has received a special award for its customer focus at yesterday’s ceremony of the prestigious European Foundation for Quality Management (EFQM) Excellence Award. The award was presented in recognition of the organization’s track record in delivering outstanding customer satisfaction, its customer-centric approach to business, and its abili...

NXP Semiconductors today unveiled intelligent switches supporting the new HDMI 1.4 specification released in June 2009. The NXP TDA19997 and TDA19998 smart switches support the Audio Return Channel (ARC) feature, a new option introduced in the HDMI 1.4 release, which reduces the number of cables required to deliver audio upstream for processing and playback. Building on the success of previous HDMI smart switches from NXP, the TDA19997 and TDA199...