NXP Semiconductors, your partner in Automotive Telematics (Road pricing, eCall, ATOP, On Board Unit, OBU)

NXP Semiconductors N.V. has announced the DAC1627D – a 16-bit dual-channel LVDS DDR interface Digital-to-Analog Converter (DAC) which supports output update rates of up to 1.25 Gsps. In terms of dynamic performance specifications, this new high-speed DAC offers best-in-class single tone SFDR performance and two-tone intermodulation distortion over a broad output bandwidth of 200 MHz. The first public demonstration of the DAC1627D will be made i...

NXP Semiconductors N.V. announced an addition to its broad GreenChip™ SSL family of products, the GreenChip SSL4101T controller IC, which offers new levels of professional-grade performance for Solid State LED lighting power supplies.

NXP Semiconductors N.V. today inaugurated the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I 2 IT).

New CGVxpress extends high speed serial interface leadership providing higher bandwidth, deterministic latency and harmonic clocking for WIFR, ISM and A&D applications

NXP Semiconductors today inaugurated the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I 2 IT). Located at I 2 IT Pune Campus,this Center of Excellence will provide unique infrastructure and collaboration of the industry and academia. The center will foster the innovation in the field of automotive electronics and would provide students, faculties, automotive Original Equi...

An introduction to the Development Tools for NXP's new LPC1800 microcontroller.

Deutsche Bahn and NXP Semiconductors announced to continue their co-operation on “Touch&Travel” in Germany. “Touch&Travel” is a mobile ticketing scheme which is running in a pilot phase in Germany since 2008. Using Near Field Communication (NFC) the ticketing system enables e-ticketing based on NFC-enabled mobile phones. Deutsche Bahn and NXP together with other project partners co-operated in the pilot phase and are now joining forces to...

NXP Semiconductors N.V. today announced that it has shipped more than half a billion ABS speed sensor modules – a key milestone in NXP’s relationship with Continental, one of the leading global automotive suppliers. The Chassis & Safety Division of Continental has worked closely with NXP to develop advanced ABS/ESC sensor modules that are now used by most car manufacturers in the world, in both the standard and high-end segments of the market...

RFID-based SmartSponge System helps prevent retained foreign objects in surgical patients

NXP Semiconductors N.V. and UPM RFID, today announces collaboration to provide easier access to near field communication (NFC) tags for use in a variety of mobile applications.

NXP Semiconductors N.V. has announced the launch of its Global RFID Innovation Partner Program to encourage the development of RFID solutions.

NXP Semiconductors N.V. announces its latest high-performance UHF and HF offerings, including the UCODE G2iM and G2iM+ ICs, which offer up to 640 bits of segmentable user memory.

NXP Semiconductors N.V. (NASDAQ: NXPI), the market leader in RFID solutions, today unveiled its groundbreaking UCODE I2C chip, which features an integrated I2C interface and a large 3,328-bit user memory.

NXP Semiconductors, the RFID leader for multi-applications, announced that ClearCount Medical Solutions has selected NXP RFID solutions to enable its SmartSponge® System. The SmartSponge System can easily and accurately detect and account for surgical sponges placed in a patient’s body when undergoing surgery, so that no items are “left behind,” thus improving patient safety.

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its LPC11U00 series – a low-cost ARM Cortex™-M0 based microcontroller featuring a new, highly flexible USB architecture, as well as a smart card interface. Equipped with a highly configurable Full Speed USB 2.0 device controller, the LPC11U00 brings unparalleled design flexibility and reliable USB connectivity for consumer electronics and mobile devices.

HID Global, trusted leader in solutions for the delivery of secure identity, and NXP Semiconductors N.V. (NASDAQ: NXPI), today announced that HID Global will integrate NXP’s MIFARE™ technology into its multi-standard physical and logical access readers and software.

Today, NXP Semiconductors made two major announcements underscoring its commitment to the growing automotive market in China. NXP has established a new China Automotive Technical Center to focus on R&D, system innovation and customer application support, and has also moved its Automotive sales and marketing headquarters to Shanghai.

RFID Munich Central library

NXP Semiconductors announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium.