Recognized as a compelling alternative to silicon for many RF applications, GaN technology has generated significant industry interest due to its performance advantages, but has faced significant challenges related to cost – until now.

NXP Semiconductors today introduced the industry’s first MOSFETs in a 2-mm x 2-mm low-profile DFN package with tin-plated, solderable side pads. These unique side pads offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.

NXP Semiconductors N.V. today released its new LFPAK33 portfolio – a range of high switching performance MOSFETs available in an ultra-reliable 3.3-mm x 3.3-mm power package. Unlike many MOSFET packages of this size, LFPAK33 has been designed from the ground up to be a tough power solution.

NXP Semiconductors N.V. today introduced the BGU706x series of multi-stage base station LNAs with variable gain featuring the industry’s lowest noise figure of 0.9 dB for a receive chain in silicon. The architecture of the LNA is based on the integration of a very low-noise LNA with a bypass function followed by an analog-controlled variable gain amplifier.

NXP Semiconductors N.V. today announced the expansion of its eighth-generation LDMOS RF power transistor portfolio for wireless base stations, featuring excellent linearized efficiency, gain and wideband capability.

NXP Semiconductors N.V and security specialist Giesecke & Devrient today announced an agreement enabling G&D to integrate NXP’s MIFARE technology into its portfolio of secure SIM products. With the new MIFARE DESFire and MIFARE Plus based SIM cards, including backward compatibility to MIFARE Classic, G&D can now serve the growing demand of mobile network operators for enhanced NFC solutions with mobile ticketing as well as mobile payment capabi...

NXP Semiconductors today introduced the SSL21101 - the first in a new family of GreenChip LED driver ICs featuring Smart Digital Control (SDC) technology. Incorporating intelligent digital control within a compact analog design, the SSL21101 delivers better, more accurate system performance while reducing the bill of materials, providing an ideal solution for non-dimmable, high-performance LED applications up to 15W. NXP is now featuring the SSL2...

NXP today announced the SSL2115x series of high-efficiency GreenChip driver ICs for low-cost LED retrofit lamps. The new SSL21151 and SSL21153 are designed for non-dimmable 5W and 10W LED lamps respectively, providing good current control in flyback and buck-boost configurations. The SSL2115x enables small form-factor LED drivers, using primary-side sensing to regulate current, and offering integrated LED open/short protections, an internal 700V ...

XP Semiconductors N.V. today announced the availability of two high-speed multiplexer switches supporting Thunderbolt I/O technology developed by Intel Corporation. Thunderbolt technology enables fast data transfers between PCs and peripheral and display devices by concurrently supporting data and display connections over a single cable.

In this session, we explain the benefits of Boundary Conduction Mode (BCM) in power supply controls, including reduced switching losses, smaller components, better control, lower EMI level and high efficiency.

NXP Semiconductors N.V. today introduced the BGA7204 and BGA7210 – two 6-bit digital variable gain amplifiers offering high linearity, low noise and low power consumption across a very wide frequency band. The BGA7210 is the only device of its kind capable of working as a VGA up to 4 GHz without external matching.

NXP Semiconductors N.V today introduced a new family of automotive power MOSFETs based on NXP’s Trench 6 technology, featuring extremely low RDSon, high switching performance, and outstanding quality and reliability. Fully AEC-Q101 qualified, NXP’s new automotive-grade MOSFETs have successfully completed extended lifetime testing at 175°C for more than 1,600 hours – significantly exceeding Q101 requirements – as well as offering extremel...

NXP Semiconductors N.V. today announced that Nordic Semiconductor has selected NXP’s low-power LPC1114 microcontroller in its latest Bluetooth low energy reference designs. Based on the energy-efficient ARM Cortex-M0 processor, the NXP LPC1114 is featured alongside Nordic’s nRF8001 Bluetooth low energy connectivity IC in the nRFready µBlue Desktop reference design for wireless mouse and keyboard.

Today, NXP Semiconductors N.V. announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the best-selling Samsung GALAXY S II.

What if every light bulb had an Internet IP address? Since NXP Semiconductors N.V. first raised the question at LIGHTFAIR International (LFI) nearly one year ago, interest in IPv6-enabled smart lighting has soared. The potential energy and cost savings – as well as the comfort, convenience and lifestyle benefits for the consumer – have mobilized a growing ecosystem of innovators in lighting, connectivity, energy management and home automation...

NXP Semiconductors today announced the availability of the SSL2109 – a high-efficiency buck controller for high-power, non-dimmable LED lighting applications using non-isolated topologies. Designed for use with an external power switch, the SSL2109 LED driver IC provides a single design platform for 100V, 120V and 230V mains input voltages and power ranges up to 25 W. By offering a controller-only version of the popular SSL2108x family, the SSL...

NXP Semiconductors N.V. today introduced the industry’s first development platforms for DALI and DMX512 wired lighting control systems based on the low-cost, low-power 32-bit ARM Cortex-M0 processor. The new evaluation systems feature an NXP LPC1100XL series microcontroller, which is uniquely suited to handle the communication requirements for intelligent lighting projects using DALI and DMX.

NXP Semiconductors N.V. today introduced the industry’s first high-performance I²C-bus controllers capable of handling both Fast-mode Plus (Fm+) and the new Ultra Fast-mode (UFm) specification, which has transmit-only data transfer rates up to 5 Mbit/s.

NXP Semiconductors, today announced the TEF664x, a new addition to its highly successful family of RFCMOS-based one-chip car radio solutions. The TEF664x integrates a low-IF AM/FM tuner and DSP processing all in one chip and is designed for single-tuner applications (see TEF664x introduction video).

Starting today engineers can more easily browse, store and link products to projects using NXP Semiconductors’ N.V. newest mobile app – ‘Tech bench.’ Tech bench is an intuitive, feature-rich iPAD app allowing engineers to access NXP’s full product portfolio; to collect datasheets, application notes and quality information; and to ‘drag and drop’ product or application data in self-defined project sections.