Nihon Superior Co. Ltd. announces that it has received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire. The award was presented to the company’s President, Tetsuro Nishimura, during a ceremony that took place on Tuesday, February 28, 2012 at the San Diego Convention Center in California.

Nihon Superior Co. Ltd will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co. Ltd. announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference, scheduled to take place March 11-15, 2012 at Walt Disney World Swan and Dolphin Resort in Florida.

Nihon Superior Co. Ltd. announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. This presentation will be held during the session titled “Solder Joint Morphology” on Wednesday, February 29, 2012 from 9-10 a.m.

Nihon Superior Co. Ltd. announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The first presentation will be held during Session TA1, titled “Pb-Free Advancements” on Tuesday, February 14, 2012, and the symposium Keynote II will be held on Wednesday, February 15, 2012.

Nihon Superior Co. Ltd. announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The presentation will take place during Session TA1, titled “PB-Free Advancements” on Tuesday, February 14 at 9:30 a.m.

Nihon Superior Co. Ltd announces that it has received a Global Technology Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire. The award was presented to the company’s President, Tetsuro Nishimura during a ceremony that took place on Tuesday, November 15, 2011 at the New Munich Trade Fair Centre, Germany during Productronica 2011.

Nihon Superior was honored to receive a visit by a delegation from the University of Queensland on October 7, 2011. Senior Deputy Vice-Chancellor Professor Michael Keniger was accompanied by Deputy Vice-Chancellor (International) Anna Ciccarelli, Ph.D., Deputy Director Global Engagement, Michelle Allan, Associate Professor and Principal Research Fellow, Mechanical and Mining Engineering Department, Dr. Kazuhiro Nogita and Business Development Off...

Nihon Superior Co. Ltd. announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Texas. The presentation will be held during session MFX3, titled “Lower Cost Alternative Lead-Free Alloys f...

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C solder pastes. The guide includes a detailed list of features for SN100C Solder Pastes.

Nihon Superior Co. Ltd., will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.

Nihon Superior has been honoured with a 2010 Industrial Commendation Award from the local government in the area in which its headquarters is located, Suita City in Osaka Prefecture, Japan.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has won 2011 NPI Awards in two categories: Solder and Flux, for the halogen-free materials, flux-cored solder wire SN100C(044) and wave soldering flux NS-F900. The high activity of these two halogen-free soldering materials have been to be comparable with that of equivalent halogenated products.

FCT Assembly announces that it received an appreciation award during a dinner ceremony hosted by Nihon Superior Co. Ltd. on Wednesday, April 13, 2011 during the IPC APEX EXPO in Las Vegas.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a 2011 NPI Award in the category of Cored Wire for its SN100C (044) Flux-Cored Solder Wire. The award was presented to the company and accepted by the company’s President, Tetsuro Nishimura, during a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APE...

Nihon Superior Co. Ltd announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled “Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies” at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co Ltd announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled “The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints” at the upcoming TMS 2011 Annual Meeting & Exhibition. The presentation will take place Thursday, March 3, 2011 from 9:15-9:45 a.m. at the San Diego Convention Center in San Diego, CA.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan. The presentation will take place during session INJ-2, titled...