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Nexperia

Nexperia Articles

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Power
28th August 2018
Logic package reduces assembly costs and increases reliability

  Nexperia has announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost effective.

Passives
5th July 2018
ESD protection series deliver high surge robustness

Nexperia has announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the s...

Power
7th June 2018
Lowest RDS(on) automotive MOSFETs down to 0.9mΩ

Nexperia has announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices. The 0.9mΩ, 220ADC-rated BUK9J0R9-40H MOSFET suits applications up to 1.2kW, and is al...

Analysis
19th April 2018
Nexperia secures $800m financing to fund future growth plans

Nexperia has announced the completion of a refinancing of its current facilities with $800m equivalent of senior credit facilities. This includes a significant proportion of Revolving Credit facility. The proceeds will be used to refinance existing outstanding debt and for Capex expenditure to fund future growth. The facilities were arranged by Bank of America Merrill Lynch and HSBC, acting as Global Coordinators, and were syndicated by a gr...

Power
12th March 2018
Broad range of space-saving PN and Trench Schottky rectifiers

Nexperia has announced the launch of a wide range of PN and Trench Schottky rectifiers for power applications including automotive, industrial and consumer. In total, the company now offers more than 90 devices in the CFP packages. Nexperia CFP packaging is size- and thermally-efficient. The package design has a solid copper clip and exposed heat sink to reduce the package’s thermal resistance and optimise the transfer of heat into the...

Test & Measurement
7th March 2018
Nexperia opens expansion at Guangdong assembly and test facility

Nexperia formerly opened a significant expansion to its ATGD discrete semiconductor assembly and test plant in Guangdong, China. The total production and warehouse site now covers an area of around 72,000m², adding an extra 16,000m² of production space. This will enable the factory in Guangdong to produce 90 billion parts annually, representing an increase of around 50% depending on product mix, and supporting Nexperia’s ambi...

Power
2nd March 2018
Next-gen devices improve switching efficiency

  Nexperia has announced its NextPower 100V family of power MOSFETs which delivers low reverse recovery charge (Qrr) and includes parts that are qualified to 175°C in the LFPAK56 (PowerSO8) package.

Robotics
2nd March 2018
Nexperia supports engineers of the future with sponsorship

  Nexperia has announced that it will be the main industry sponsor for the University of Twente’s RoboTeam, a multidisciplinary student group that aspires to innovate in both robotics and artificial intelligence.

Power
28th February 2018
Logic dividers deliver space-saving up to 93% for system efficiency

Nexperia has announced a new range of AHC (Advanced High speed CMOS) dividers with oscillators that save space, increase efficiency and reduce overall system cost. This new 74AHC1G42xx dividers range also offers overvoltage-tolerant inputs for mixed voltage mode operation, increasing reliability and flexibility in designs.

Power
19th December 2017
Translator solution addresses standard logic shift register market

  Nexperia has announced that it is expanding its logic portfolio with new devices that expand the company‘s translator solutions into the standard logic shift register arena.

Power
5th October 2017
Robust MOSFETs suitable for automotive applications

  Former Standard Products division of NXP, Nexperia, has announced a new series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness.

Power
26th September 2017
Automotive power MOSFETs designed for space efficiency

The former standard products division of NXP, Nexperia has announced a new range of 80V dual Power-SO8 MOSFETs in the popular LFPAK56D package. With the addition of this new 80V range of MOSFETs, Nexperia now offers what it claims to be the industry’s most comprehensive portfolio of devices, ranging from 30-100V. LFPAK56D is fully automotive qualified to AEC-Q101 and has a proven track record for quality and reliability.

Power
5th September 2017
Protection portfolio with three TVS diode families

  Nexperia has announced three miniature TVS diode families that are available in space-saving packages for applications in portable devices, including USB – Power Delivery (USB-PD) protection. All the new parts feature high surge ratings and high peak pulse power.

Robotics
31st July 2017
They think they’re all robots… They are now

It has been announced that the University of Twente’s RoboTeam, a multi-disciplinary student group that aspires to innovate in both robotics and Artificial Intelligence (AI), has received sponsorship from Nexperia, the former Standard Products division of NXP. The team competed in RoboCup 2017, the world championships of robot soccer in Japan which focuses mainly on AI.

Automotive
27th March 2017
Achieving automotive power in a smaller package

At embedded world Nexperia, the former Standard Products division of NXP, announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. LFPAK33 devices also feature a lower resistance, responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and re...

Power
15th March 2017
Automotive power MOSFET package is 80% smaller

Nexperia has announced the availability of its automotive power MOSFETs in the LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices. LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.

Analysis
15th March 2017
EMI and ESD protection in single package with tiny footprint

  Nexperia has announced three series of common mode EMI filters with integrated ESD protection: PCMFxUSB3S, PCMFxHDMI2S and PESDxUSB3S, which provide support for USB 3.1 Type C, HDMI 2.0 and MIPI M-PHY interfaces. Using the same footprint, Nexperia’s TrEOS ESD protection diodes are offered in the same package.

Analysis
8th February 2017
An emerging force in discretes, logic and MOSFETs

It was announced yesterday that Nexperia, the former Standard Products division of NXP, has completed its launch as a separate entity. Headquartered in Nijmegen, Netherlands and backed by a consortium of financial investors, Nexperia is a stand-alone player in the world of discretes, logic and MOSFETs, retaining all the expertise, manufacturing resources and key personnel of the former NXP division.

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