Semiconductor manufacturers are continuously pushing the boundaries of their process technologies to enable designers, in turn, to explore the limits of existing circuit topologies while also developing new ones.

As the pioneers of copper-clip packaging technology, Nexperia bring20 years’ expertise in high-quality, robust SMD packaging to itsGaN FET portfolio. Adopting proven technology, CCPAK gives industry-leading performance in an innovative package. The copper-clip, cascode designoptimizes thermal and electrical performance making them ideal to meet the demands of next-generation industrial and renewable energy applications. 

 Nexperia has announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.

Nexperia has announced its first SiC MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ.

Space-saving, thermally efficient, and robust semiconductor packages are needed for transistors and diodes. And while for many product generations, designers have relied on established packages like the SOT23 and SMA families, we see the high performing clip-bond and leadless package outlines such as CFP and DFN clearly winning on value for money.

Nexperia has announced a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFETs.

Nexperia announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links and Ethernet in automotive infotainment applications.

Nexperia, an expert in semiconductors, has released a new series of 500 mA dual resistor equipped transistors (RET) in ultra-compact DFN2020(D)-6 packaging.

Nexperia is a rapidly growing global semiconductor company headquartered in the Netherlands, with over 60 years of history.

Nexperia, the essential semiconductor expert, announces the expansion of its analog and logic product portfolio with the introduction of the load switch product family.

Complementing Nexperia’s growing high-voltage technology portfolio, and addressing the demands for efficient, high-voltage devices, Nexperia introduces 600 V IGBTs. Available in TO-247-3L packaging, choose between the medium speed (M3) or high speed (H3) series. Providing low conduction and switching loss performance with high levels of ruggedness in operating temperatures up to 175°C.  Learn more about Nexperia IGBTs at nex...

Nexperia has just introduced the NBM7100 and NBM5100, new types of battery life boosting ICs designed to extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x compared to what a typical coin cell can deliver without a battery booster.

Nexperia has launched its entry to the insulated gate bipolar transistor (IGBT) market with a range of 600V devices, starting with the 30A NGW30T60M3DF. 

Nexperia announced a broadening of package options for its NextPower 80/100V MOSFETs portfolio, previously only available in LFPAK56E, to now also include LFPAK56 and LFPAK88 packaging.

Nexperia, the essential semiconductor expert, has announced a significant raising of the bar in semiconductor engineer design support with the release of next-generation interactive datasheets to accompany its Power MOSFETs.

Nexperia, an expert in essential semiconductors, has released its first Power GaN FETs in e-mode (enhancement mode) configuration for low (100/150V) and high (650V) voltage applications.

Nexperia has introduced a portfolio of 16-channel I2C general-purpose input-output (GPIO) expanders designed to increase flexibility and reuse in electronic systems.

Nexperia has introduced a 650V Silicon Carbide (SiC) Schottky diode designed for power applications which require ultra-high performance, low loss, and high efficiency. 

Nexperia has announced an expansion to its range of Power ICs with Energy Harvesting solutions to simplify and enhance the performance of low-power IoT and other embedded applications.

Paige West speaks with Chris Boyce, Senior Director, Marketing & Product Group, BG MOS Discretes, Nexperia about LFPAK technology.