NEON-EK introduces foiled aluminum for PCB production from Polytronics Technology Corporation. The main characteristic of this material is high thermal conductivity that is 20 times higher than traditional epoxy system that allows applying it in systems with intensive heat-up. While PCB based on Polytronics foiled aluminum is affected by high temperature, it saves its form and has no bending.

NEON-EK stock has been supplied with RF-INRA30DS- EB (warm white, 120 degree, 900 mcd) and RF-WNRA30DS-EB (white, 120 degree, 1200 mcd) packaged in PLCC-2. It is SMD LEDs based on EPISTAR chips by REFOND Optoelectronics.

Silan Microelectronics represents the fourth generation of high-voltage MOSFET of SVF series produced on their own patented technology F-cellTM. For example, SVF1N60 1A\600v has channel resistance less than 8 ohm, in difference to previous generation of the transistors having the similar characteristic ~11 ohm. “Flagship” devices SVF8N80 and SVF12N65 by Silan have channel resistance about 1 ohm.

NEON-EK stock has been supplied with RF-INRA30DS- EB (warm white, 120 degree, 900 mcd) and RF-WNRA30DS-EB (white, 120 degree, 1200 mcd) packaged in PLCC-2. It is SMD LEDs based on EPISTAR chips by REFOND Optoelectronics.

Recently NEON-EK stock has been supplied with foiled aluminum from Politronics Technology Corporation. It is used for printed circuit board production. The insulator is made of unique polymer composite, which combines an epoxy resin and high thermal conductivity filler. The thermal conductivity of such material is about 20 times higher than conventional epoxy system filled with glass fiber.

The conference will be held in Sofia, Bulgaria on 14.07.2011 from 09.30 a.m. Till 17.00p.m.at Hall “Conference 5 ” in Park Hotel Moscow.