Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM. The patent pending ecoAmp is a state-of-the-art solution for high-power applications of 1000+ amperes.

Multitest announces that the new Access+ contact unit holder for the MT9510 significantly shortens the downtime of the test cell. The Access+ CUH has been developed for quick and easy access to the contactors, centering plate and adapter board.

Multitest has announced that it will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer level test to final test – for standard ICs and sensor packages. Multitest Quad Tech applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, hig...

Multitest will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer level test to final test – for standard ICs and sensor packages. Multitest sensor test modules combine the advantages of well-established and production proven tri-temp test handling equipment with innovative concepts to m...

Multitest congratulates the winner of its recent survey, Mr. Rafael Reyes. Among all survey participants, the company held a drawing for an iPad mini. From the survey, Multitest received very valuable feedback and would like to thank all participants for their contribution.

Multitest has today announced that Melexis has chosen Multitest’s Standard MT9510 Pick and Place Test Handler for an infrared, light sensing application. Multitest cooperated closely with Melexis to successfully develop a dedicated conversion kit to support this sensor application by integrating a 3rd party stimulus provided by Melexis.

Multitest will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ. Multitest combines long-term experience in semiconductor test with the expertise of its specialists and state-of-the-art tools to apply industry-leading methods for optimizing test equipment and interfaces.

Multitest is proud to announce that it will be presenting a paper during the European 3D TSV Summit (Grenoble - Jan 22-23, 2013). The presentation will focus on quality and test-related issues in assembly of 3D ICs. Stacking dies bears a much higher risk for failure than single die technologies. Failures may happen in the dies themselves, but additionally, can potentially occur within the interposers, the laminations and in the connections.

Multitest has today revealed that its equipment fully supports the advantages of MEMS Oscillators. MEMS oscillators are considered to be a favorable alternative to the long-established, quartz crystal oscillator technology. Today they represent approximately 1% of the timing market, but significant growth is expected in the future.

Multitest announces that its MT9510 x16 has proven its outstanding temperature accuracy of ±2.0°C at an Asian high-volume production site. Multitest always applies the strictest measurement methods for indicating temperature accuracy, i.e. the figure stands for the dynamic temperature accuracy measured at the device under test for the entire test time.

Multitest announces that its Mercury contactor with Q-tip successfully passed a two-month evaluation at a US-based IDM with test operations in Southeast Asia with excellent first-pass yield for more than 500k insertions. Single point spring probes face limitations in terms of targeting a large enough area to ensure contact with device under test pads over the full temperature range of -55° to 150°C.

Multitest announces that Business Unit Manager Günther Jeserer chaired the Docking and Mounting Working Group conducted by the Collaborative Alliance for Semiconductor Test, which began its activities under the SEMI organization in 2008. The final result of this initiative recently was released by SEMI.

Multitest’s BlueLine contactors make the high performance Multitest cantilever contacting technology available for non-Multitest handlers as well. Although we are known for one-stop Plug&Yield solutions, our contactors are well established and successfully deployed on other handler brands.

Multitest announces today that its service contracts provide professional on-site support from Multitest experts. Best maintained equipment is key to highest overall equipment effectiveness.

Multitest is pleased to announce that its Pulse Plating Process grants significant advantages in terms of fabrication cost and cycle time. Multitest Pulse Plating has been released to manufacturing for all major board customers. The proprietary Multitest process has proven market-leading performance in various customer applications.

Multitest has today revealed that it now offers the MT2168, benchmark pick & place handler, with optional 2D code reader to ensure 100 percent device traceability and lot integrity. The 2D code reader identifies each single package.

Multitest is pleased to reveal that its MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor. Field proven temperature performance and highest positioning accuracy ensure cost-efficient and reliable tri-temp testing as well as highest test yield.

The first Multitest Plug & Yield solution from Multitest has recently been released to the customer’s production. James Quinn, VP Sales and Marketing, commented: “Multitest is the first equipment supplier to deliver a full turn-key hardware set up for in-process test in 3D assembly.

VP Bernhard Lorenz will present at the upcoming Test Vision 2020 Conference, scheduled to take place July 11-12, 2012 at the San Francisco Marriott Marquis during SEMICON West 2012. The presentation titled “Enabling Highly Parallel Test of SOCs, Sensors and 3D Packages,” will be held on Thursday, July 12, 2012 from 1:30-2 p.m.

Multitest announces that its InCarrier Loader/Unloader is available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination. Additionally, partner solutions for loading from wafer ring or unloading into tape-and-reel can be offered.