Molex Incorporated
- Molex
2222 Wellington Court
Lisle, IL 60532-1682
United States of America - 1 800-78MOLEX
- http://www.molex.com
- (1) 630-968-8356
Molex Incorporated Articles
Molex introduces LED Printed Circuit Assemblies
Molex Incorporated announces the availability of its Light Emitting Diode Printed Circuit Assemblies. Combining Molex’s LED and Printed Circuit Assembly design and manufacturing expertise, these dependable and efficient custom-lighting solutions work seamlessly for LED subassemblies across several industries.
Molex and Bridgelux win Most Innovative Product of the Year Award for Helieon at LIGHTFAIR 2010
Molex Incorporated and Bridgelux were presented the Most Innovative Product of the Year Award for the Helieon™ Sustainable Light Module at this year’s LIGHTFAIR International in Las Vegas. This is the highest award bestowed by the judges and recognises the best new product out of nearly 200 submissions. The Helieon Sustainable Light Module also won in the category of “specialty lamps”, one of the 14 product categories eval...
Molex introduces Multi-Drop Sealed Connector and Cable System
Molex announced today the availability of the Multi-Drop Sealed Connector and Cable System, a sealed, modular, cable connector system for the transfer of both power and data/signal in a multi-drop configuration. Using cable-pierce technology to deliver a rugged, free-form, pluggable connector string, the Multi-Drop Sealed Connector and Cable System is fully sealed to IP66 and IP67 ratings, and can be customised to meet any requirements for intern...
Molex expands Mini-Fit family with two high-current, high-density products
Molex Incorporated expands its Mini-Fit family with the addition of two new products. Both products meet the high-current and high-density standards found in the Mini-Fit family and are ideal for a wide range of industries and applications including telecommunications, medical, industrial equipment, personal computers and power supplies.
Molex launches SolarSpec Junction Box for Silicon Photovoltaic (PV) Solar Panels
Molex has released the SolarSpec Junction Box and Cable Assemblies designed for installation on the back of mono- and polycrystalline photovoltaic (PV) solar modules. These products provide the interface between the conductor ribbons on the panel and the DC I/O cables. Molex SolarSpec solutions are specifically designed for applications in the solar and renewable energy industry.
Next-Generation PRIZM LightTurn Cable Assemblies from Molex
Molex Incorporated announces the availability of PRIZM LightTurn cable assemblies that mate to Avago Technologies’ new MicroPOD 120 Gbps board mounted parallel optic modules. The PRIZM LightTurn’s vertical mating capability improves airflow and cable management as well as increases real-estate opportunities on dense printed circuit boards (PCB).
Helieon LED Light Module to displace traditional lighting with plug-and-play solution as simple to use as a light bulb
Bridgelux and Molex introduced the first LED lighting solution designed and priced to drive rapid, mass market adoption of LED lighting technology. The new Helieon™ Sustainable Light Module combines industry-leading solid state lighting technology from Bridgelux with innovative, easy-to-use interconnect technology from Molex, delivering to interior and exterior luminaire manufacturers effortless installation, interchangeability and upgradea...
Helieon LED Light Module to displace traditional lighting with plug-and-play solution as simple to use as a light bulb
Bridgelux and Molex introduced the first LED lighting solution designed and priced to drive rapid, mass market adoption of LED lighting technology. The new Helieon™ Sustainable Light Module combines industry-leading solid state lighting technology from Bridgelux with innovative, easy-to-use interconnect technology from Molex, delivering to interior and exterior luminaire manufacturers effortless installation, interchangeability and upgradea...
CIP is the only CIP Safety Stack to support both DeviceNet and EtherNet/IP
Molex Incorporated will announce its Common Industrial Protocol (CIP) Safety Software Kit (Stacks) at Hanover Messe, April 19-23, 2010. The Molex CIP Safety Stack allows manufacturers of intelligent industrial products to implement the safety application layer required to comply with the ODVA CIP Safety Specification.
Molex high performance LC2+ Metallic Optical Connector for harsh environments
Molex announced the new LC2+ optical interconnect product line. The latest offering by Molex for high-density harsh environment optical applications, the LC2+ optical interconnect is a metal connector body and latch version of the popular LC connector system.
Molex opens mobile product design facility in Beijing
Molex has opened a mobile product design facility located in Beijing, the hub for mobile device development in China. Molex will provide front-end solution support for mobile antenna and connector designs developed in collaboration with customers at the newly established location.
TM-4000 universal crimp press from Molex terminates large lug products up to 4 AWG
Molex announced its heavy-duty TM-4000 Universal Crimp Press provides up to 31 kN (7000lbf) for bench-top crimping large lug products of up to 4 AWG. The TM-4000 Universal Crimp Press is an inexpensive, electrically controlled, direct-drive press designed for mid-volume, semi-automatic bench-top operations such as those found in the automotive, industrial and commercial markets. Capable of production rates of up to 2,400 terminations per hour, th...
Molex sockets for servers, desktops and notebooks earn Intel validation
Molex Incorporated is pleased to announce that three of its socket products have met the stringent criteria for Intel* validation. Molex is one of only three vendors whose socket product families are validated across all three computer market segments of server, desktop and notebooks. As an Intel-enabled vendor, Molex sockets are compatible with Intel’s reference design and pass the criteria set for electrical performance and long-term reli...
Brad PLC Communication Modules from Molex now offered with Add-On-Profiles
Molex Incorporated announced its Brad PLC communication modules are now offered with Add-On Profiles (AOPs) for Rockwell Automation’s RSLogix 5000 software. Brad PLC communication modules provide the interface required for a Rockwell Automation ControlLogix* PLC to connect to specific industrial fieldbuses.
Molex extends Impact Backplane Connector System with two new configurations
Molex Incorporated has released two additions to the Impact Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimise designs for superior mechanical and electrical performance.
Molex announces iPass+ HSC CXP Copper and Optical System for fast and flexible system hardware
Molex announces the iPass+ High-Speed Channel (HSC) pluggable CXP copper and optical interconnect system enabling 12 channels of 10 Gbps data, for up to 120 Gbps of total bandwidth. The iPass+ CXP provides both copper and optical direct attach options for the same system port, thereby increasing the flexibility of system-level hardware for end users. This innovative dual paddle-card system was adopted as the InfiniBand* Architecture Specification...
Molex expands its EdgeLine family of products with CoEdge connector
Molex introduced a new addition to its EdgeLine family of connectors. The EdgeLine CoEdge, which was recently nominated as a DesignVision finalist at the DesignCon 2010 show, is a one-piece, 25 Gbps connector that is configured to meet an industry standard pitch of 0.80mm (.031”). This low-profile, dual-sided, edgecard connector supports sixteen PCB thickness variations with multiple circuit sizes for high-speed, industry-standard, edgecard...
Brad PLC/PAC Communication Modules from Molex now supported within Integrated Architecture Builder
Molex announced its Brad PLC/PAC communication modules for the ControlLogix and SLC 500 systems are now supported within Rockwell Automation’s Integrated Architecture Builder (IAB).
Molex claims industry’s smallest SMT Board-to-Board connector
Molex introduced its SlimStack Board-to-Board series of miniature connectors that have a 0.40mm pitch, 0.70mm mated height and 2.60mm width. The new connectors offer a better combination of overall space savings and reliable electrical contact when compared to similar versions in the marketplace today.
Molex - Quad Small Form-factor Pluggable Plus (QSFP+) solution
Molex introduced the Quad Small Form-Factor Pluggable Plus (QSFP+) interconnect solution designed for a multitude of markets and applications including switches, routers, Host Bus Adapters (HBAs), enterprise data centres, high-performance computing (HPC) and storage. Components of the system include the Electromagnetic Interference (EMI) shielding cage, passive cable assembly, active cable assembly, optical MTP cable assembly, optical loopback an...