Micron announces that Glen Hawk, vice president of NAND solutions, will keynote at Flash Memory Summit on Tuesday, August 21, at the Santa Clara Convention Center in Santa Clara, California. With 28 years of semiconductor industry experience, all focused on nonvolatile memory, Hawk will explain how flash-based architectures are enabling the connected world, providing ubiquitous, fast access to information.

Micron has today revealed high-volume availability of its 45-nanometer Phase Change Memory for mobile devices, featuring 1-gigabit PCM plus 512-megabit LPDDR2 in a multichip package. Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

Micron Technology, Inc. and Elpida Memory, Inc.'s trustees announced today that the parties have signed a definitive sponsor agreement for Micron to acquire and support Elpida. The agreement has been entered into in connection with Elpida's corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court.

The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology (Nasdaq:MU) and Samsung Electronics Co., Ltd., today announced that new members ARM, HP, and SK hynix, Inc. have joined the global effort to accelerate widespread industry adoption of Hybrid Memory Cube (HMC) technology.

Micron Technology, Inc., today announced results of operations for its third quarter of fiscal 2012, which ended May 31, 2012. For the third quarter, the company had a net loss attributable to Micron shareholders of $320 million, or $0.32 per diluted share, on net sales of $2.2 billion.

Micron Technology, Inc. today introduced a new class of 1GHz, 2-gigabit and 4Gb, 30-nanometer DDR3 devices, strengthening the company's comprehensive DDR3 portfolio. Designed for the high- performance networking and discrete graphics markets, the new devices feature industry-leading low power use while delivering speeds up to 2133 megatransfers per second.

Micron Technology, Inc. today confirmed it is engaged in discussions with Elpida Memory, Inc.'s trustees to acquire Elpida's business. to acquire Elpida's business.

The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. and Samsung Electronics Co. Ltd. today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC).

Micron Technology, Inc. today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.

Micron Technology, Inc. today announced the pricing of an offering of $480.0 million aggregate principal amount of its 2.375% convertible senior notes due 2032 (the 2032C Notes) and $390.0 million aggregate principal amount of its 3.125% convertible senior notes due 2032 (the 2032D Notes and, together with the 2032C Notes, the Notes). The Notes are being offered in the United States to qualified institutional buyers pursuant to Rule 144A under th...

Micron Technology, Inc. today announced a new solid-state drive (SSD) that broadens Micron's client product portfolio to serve the rapidly emerging Ultrabook category. The newly announced drive is based on the proven architecture of Micron's popular RealSSD C400 drives, providing the same high performance and reliability.

Micron Technology, Inc. announced today that it reached an agreement with Oracle America Inc. (Oracle) to settle a lawsuit filed by Oracle against Micron in the U.S. District Court for the Northern District of California.

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Micron Technology, Inc. today announced that it has developed a 2.5-inch enterprise solid-state drive (SSD) based on a PCIe interface. The solution combines a high-performance PCIe interface with a hot-swappable 2.5-inch form factor that creates new options for enterprise server performance scalability and serviceability.

Intel Corporation and Micron Technology, Inc. today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship. The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron.

Micron Technology, Inc. (Nasdaq:MU), today announced details involving the public memorial service and memorial funds for Steven R. Appleton, longtime Micron Chairman and CEO, who passed away Feb. 3.

Micron Technology, Inc. is extending its legacy of memory leadership by introducing a new product category of low-power DDR3 solutions targeted at the tablet and ultrathin markets. These 2-gigabit (Gb) and 4Gb DDR3Lm solutions focus on low self-refresh power (IDD6) for longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.

Micron Technology, Inc. today announced the appointment of D. Mark Durcan as Chief Executive Officer (CEO) of the company. Mr. Durcan will also serve as a Director on Micron's Board of Directors. The appointments come after the company reported that Steven R. Appleton, longtime Micron Chairman and CEO, passed away in a Feb. 3 airplane accident in Boise.

Micron Technology, Inc. will host an analyst conference on Friday, Feb. 10, 2012. Steve Appleton, Micron's Chairman and Chief Executive Officer, Mark Durcan, Micron's President and Chief Operating Officer, and other executive officers will present Micron's strategy and provide an update on current market conditions.

Micron announced today that its Hybrid Memory Cube (HMC) was chosen as a winner of The Linley Group's first annual Analysts' Choice Awards. The Hybrid Memory Cube won the award for Best Technology of 2011.