Denny Steele, Director of Strategic Business Marketing for Lattice Semiconductor investigates, in this ES Design magazine article, how the latest low power FPGAs are bringing an extra level of flexibility to smartphone design.

Lattice Semiconductor today announced it will demonstrate several new FPGA-based camera designs at the China Security Expo in Beijing‚ China from December 3 through December 6. Several of the camera solutions that will be featured were developed with Lattice partner organizations.

Lattice Semiconductor have today unveiled the Control Development Kit for its MachXO2 family of ultra-low density FPGAs‚ enabling low cost prototyping of complex system control and video interface designs.

Lattice has today revealed promotional pricing for its recently released iCEblink40 Evaluation Kits. The iCE40 mobileFPGA family, fabricated on non-volatile 40nm technology, is optimized for consumer and mobile applications that require low power, low cost and small footprint programmable logic devices.

Many approaches to power management sacrifice speed, cost or overall reliability. They impede the design process by requiring the consideration of hundreds of parts from different vendors, require the writing of microprocessor code and, if any hardware and timing changes need to be implemented, the board will require a respin.

Power management designs typically begin in the same way. After system requirements are determined, a laundry list of discrete power management parts are analysed for a best fit for the design. Data sheets are reviewed and ASSPs from different vendors are checked to see if they are compatible.

Many companies offer integrated hot-swap controllers that use a MOSFET to control how fast the current flows into the board’s hold up capacitor. With considerations for the variances in input capacitances of the hot-swap components, the controller timing can be set to ensure that the current does not exceed the capacity of the system, or the safe operating conditions for the control the MOSFET.

The complexity of a power engineer’s task in contemporary electronic design is made even more difficult by the range of components used and, in particular, the individual power supply requirements each of these components requires. By Jeff Hooker.

Lattice has today revealed that it has released a serial sub-LVDS bridge design to support the Sony IMX136 and IMX104 image sensors. The serial sub-LVDS format is expected to become Sony’s primary image sensor interface for embedded/industrial users.

Lattice and Leopard are pleased to today reveal the release of a dual camera module kit that allows Texas Instrument's DaVinci TMS320DM368 video processor to interface to two 720p image sensors. This kit is ideal for customers who are designing black box car drive recorders or other applications that require two cameras.

Lattice today released version 2.0 of its Lattice Diamond design software, the flagship design environment for Lattice FPGA products. Version 2.0 includes advanced support for the new LatticeECP4 FPGA family, which redefines the low cost, low power, mid-range FPGA market for cost- and power-sensitive wireless, wireline, video and computing applications.

Lattice Semiconductor Corporation today announced that it has begun shipping the highest density member of its next generation LatticeECP4 FPGA family to select customers. The new LatticeECP4 FPGA family offers the richest portfolio of low cost, low power mid-range devices under 200K LUTs, with high performance innovations such as 6G SERDES in low cost packages, powerful DSP blocks and built-in hard IP-based communication blocks.

Lattice Semiconductor Corporation announce the immediate availability of four new reference designs for the low cost, low power MachXO2 family of programmable logic devices. The new reference designs simplify and enhance the usability of the built-in I2C, SPI and User Flash Memory functions in the MachXO2 device’s unique Embedded Function Block.

MSC Gleichmann UK, Lattice Semiconductor and Atmel have announced a series of workshops aimed at helping engineers to develop systems that combine microcontrollers (MCUs) and field programmable gate arrays (FPGAs).

Lattice Semiconductor Corporation today announced a scalable, in-system upgradable, star topology power management architecture that can be used across a wide range of circuit boards requiring more than 12 power supply rails. Lattice has simultaneously made available two new application notes for its award winning Platform Manager devices that will enable customers to quickly adopt the new architecture.

Lattice Semiconductor Corporation today announced the immediate availability of its low cost, low power MachXO2 family of programmable logic devices (PLD) in a new 32 QFN (Quad Flatpack No-leads) package. Since the MachXO2 family's production release in 2011, customers worldwide have taken advantage of its innovative combination of ease-of-use, flexibility, system integration and affordability.

Lattice Semiconductor Corporation, today announced that it has released a bridge design to support the Sony IMX136 image sensor. More information about this design will be available at Lattice booth #2140 at the ISC West Conference in Las Vegas, March 28-30, 2012.

Lattice Semiconductor Corporation today announced at the Mobile World Congress in Barcelona, Spain the adoption of the MIPI Battery Interface (BIF) standard within the iCE40TM mobileFPGATM family of products. As an industry-created and adopted standard, the MIPI BIF single-wire specification accelerates the design and use of smart batteries in mobile devices.

Lattice Semiconductor Corporation today announced its plans for Embedded World 2012, which will take place Feb 28th – March 1st in Nuremberg, Germany. Lattice will be exhibiting in Hall 5, Stand 142, and will be featuring among other things its recently announced LatticeECP4TM family of devices.

Lattice Semiconductor Corporation today announced it will exhibit at Mobile World Congress, Feb 27th – March 1st at Fira de Barcelona in Barcelona, Spain. Lattice will be located in Hall 2.1, Stand 2.1A56, and will be featuring the company’s mobileFPGA™ platforms including the new iCE40™ and MachXO2™ FPGAs and ispMACH® 4000ZE CPLDs.