Laird Technologies
- Birches Industrial Estate
East Grinstead
West Sussex
RH19 1XH
United Kingdom - +44 (0) 1342 315044
- http://www.lairdtech.com
- +44 (0) 1342 312969
Laird Technologies Articles
Laird Technologies Releases the Third in a Series of Thermal Management Application Notes
Laird Technologies has announced the release of its newest application note titled “Thermoelectric Assemblies and Modules for Industrial Applications”. This application note is the third in a series of notes describing the role of Thermal Management in numerous market segments.
Laird Technologies’ Engineer Recognized for Co-Developing IEEE Std 1302 - 2008
Laird Technologies has announced one of its EMC Technical Representatives and NARTE Certified EMC & ESD Engineer, Gary Fenical, has been recognized for co-developing the IEEE Std 1302 -2008 standard for the IEEE Guide for the Electromagnetic Characterization of Conductive Gaskets in the Frequency Range of DC to 18 GHz.
Laird Technologies Enhances WISP Product Portfolio with New Power-Over-Ethernet Accessories
Laird Technologies has announced the expansion of its WISP (Wireless Internet Service Provider) product portfolio with the addition of new Power-Over-Ethernet (POE) accessories. These new, advanced accessories add user convenience and are ideal for use in remote networking and routers, SOHO equipment, access points, and bridges, as well as IP cameras, phones, and VOIP systems.
Laird Technologies Achieves Significant Milestone in Handset Industry
Laird Technologies has announced it accomplished the significant milestone of shipping 50 million antennas and 100 million metals products from its Indian facility, including board-level shielding and combination products, to its customers in India's handset market.
Laird Technologies Releases Second in Series of Thermal Management Application Notes
Laird Technologies has announced the release of its latest application note entitled “Thermoelectrics vs. Compressors in Climate-Controlled Electronic Enclosures”. This application note is the second in a series of notes describing the role of Thermal Management in numerous market segments.
Laird Technologies’ EMI Engineer Publishes Book on EMI shielding
Laird Technologies, Inc., today announced the publication of “Advanced Materials and Design for Electromagnetic Interference Shielding” by one of its subject matter experts, EMI Materials Engineer, Dr. Xingcun Colin Tong, PhD.
Laird Technologies Releases First in a Series of Thermal Management Application Notes
Laird Technologies today announced the release of its new application note titled “Thermoelectric Assemblies for Medical Applications”. This application note is the first in a series of notes describing the role of Thermal Management in numerous market segments.
Laird Technologies Launches Multi-language Versions of Website
Laird Technologies today announced the launch of its fully translated Simplified Chinese website, along with language portals for Traditional Chinese, Japanese, Korean, and German versions of www.lairdtech.com. These various language versions are accessed through the ‘Select Language’ drop-down menu on the site.
Laird Technologies Releases New Dual-Band 5 GHz Antenna
Laird Technologies today announced its new dual-band 5 GHz antenna. This new antenna system integrates the two frequency bands of 2400-2850 MHz 12dBi and 4900-5850 MHz 16dBi, the company’s patented RJ45-ECS field replaceable feed-through Ethernet connector, as well as UV-resistant radomes that are made of ASA plastic and stainless steel hardware. Additionally, seven antenna connector options are available to adapt to any user’s equipment.
Laird Technologies Releases New Dual-Band 5 GHz Antenna
Laird Technologies today announced its new dual-band 5 GHz antenna. This new antenna system integrates the two frequency bands of 2400-2850 MHz 12dBi and 4900-5850 MHz 16dBi, the company’s patented RJ45-ECS field replaceable feed-through Ethernet connector, as well as UV-resistant radomes that are made of ASA plastic and stainless steel hardware. Additionally, seven antenna connector options are available to adapt to any user’s equipment.
Patent Board Ranks Laird Technologies at 41 of the Top 50 Innovator Companies in the Telecommunications Industry
Laird Technologies today announced that the Patent Board ranks the company as #17 in Industry Impact, #19 in Innovation Cycle Time, and #41 overall in the board’s Top 50 Scorecard for Telecommunications – an increase of 16 points from its previous ranking.
Laird Technologies Releases RFID antenna with Weatherproof Enclosure for Harsh Environments
Laird Technologies today announced the release of its new RFID HD RooTenna series that offers six options of integrated RFID antennas covering 865-960 MHz. The RooTenna series integrates a high-performance RFID antenna and a compartment for reader electronics into an IP-67 rated weatherproof housing enclosure, making it ideal for harsh environments.
Laird Technologies Releases RFID antenna with Weatherproof Enclosure for Harsh Environments
Laird Technologies today announced the release of its new RFID HD RooTenna series that offers six options of integrated RFID antennas covering 865-960 MHz. The RooTenna series integrates a high-performance RFID antenna and a compartment for reader electronics into an IP-67 rated weatherproof housing enclosure, making it ideal for harsh environments.
Laird Technologies Introduces Newly Modified Air-to-Air Outdoor Thermoelectric Cooler Assemblies
Laird Technologies, Inc today announced the introduction of its newly modified Air-to-Air Outdoor Thermoelectric Cooler Assemblies. This series was modified to expand the number of outdoor applications, particularly telecom battery back-up systems and electronic integration enclosures that require cooling in harsh environments. Products in this series include the AA-100, AA-150, and AA-200.
Laird Technologies Recognized by General Motors
Laird Technologies has announced it was named General Motors 2008 Supplier of the Year for the fourth consecutive year. The company received the award for its significant contributions to GM’s global product and performance achievements at the 17th Annual “Best of the Best” Ceremonies earlier this month.
Dual-Band MIMO Internal Antenna Optimizes 802.11n System Performance
Laird Technologies has announced the availability of its new SM24513P3 Dual-Band MIMO Internal Antenna. Specifically designed to enhance the latest generation of Wireless LAN (WLAN) technology systems, the SM24513P3 embedded antenna makes use of MIMO technology in which multiple wireless transmitters and receivers operate simultaneously.
Dual-Band MIMO Internal Antenna Optimizes 802.11n System Performance
Laird Technologies has announced the availability of its new SM24513P3 Dual-Band MIMO Internal Antenna. Specifically designed to enhance the latest generation of Wireless LAN (WLAN) technology systems, the SM24513P3 embedded antenna makes use of MIMO technology in which multiple wireless transmitters and receivers operate simultaneously.
LAIRD TECHNOLOGIES INTRODUCES DECORATIVE METALS TECHNOLOGY
Laird Technologies today introduces its decorative metals technology. Metal stamping is a core Laird Technologies’ competency and the decorative metals technology is drawing from that. This technology, along with the company’s core competencies, allows the company to be a single source supplier for all types of precision metal stampings saving customers time and money.
LAIRD TECHNOLOGIES INTRODUCES T-GARD 20 THERMALLY CONDUCTIVE INSULATING MATERIAL
Laird Technologies, a leading designer and manufacturer of antenna, electromagnetic interference (EMI) shielding, telematics and thermal management solutions, introduced today its T-gard 20 high performance, cost effective thermally conductive insulating material. This product is designed for computer power supply applications.
LAIRD TECHNOLOGIES INTRODUCES THERMALLY ENHANCED BOARD LEVEL SHIELDING SOLUTION FOR HEAT REMOVAL
Laird Technologies, a leading designer and manufacturer of antenna, electromagnetic interference (EMI) shielding, telematics and thermal management solutions, introduced today its Thermally Enhanced Board Level Shielding technology (T-BLS), a RoHS compliant cooling method for electronic devices where board level shielding is required.