KYZEN’s product technology team will exhibit in booth #A-1P01 at NEPCON South China 2015, scheduled to take place August 25-27, 2015 at the Shenzhen Convention & Exhibition Center. KYZEN’s team will display the AQUANOX A4708 aqueous cleaning chemistry.

KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place 21st May, 2015. Dr. Mike Bixenman will present the paper titled How Clean is Clean Enough?

The latest stencil cleaning products will be showcased at the SMTA Carolinas Expo & Tech Forum, scheduled to take place on the 19th May 2015. KYZEN’s stencil cleaning products have been designed from the ground up to meet the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the ...

KYZEN will showcase its new stencil cleaning products with its distributor, Envoy, in Stand L501 at FIEE Brazil, scheduled to take place 23rd to 27th March, 2015 at Anhembi in São Paulo, Brazil.

At HOUSTEX, which takes place from 24th to 26th February 2015 at the George R. Brown Convention Center in Houston, TX, KYZEN will exhibit its METALNOX M6380, M6381 and M6318 solvents. These solvents are specifically designed for removing tough soils and cleaning metal parts used in the metal finishing, industrial and tooling industries.

In Booth #1011 at IPC APEX, 24th to 26th February in California, KYZEN will demonstrate its AQUANOX A4708 pH neutral electronic assembly cleaning chemistry. This product rapidly cleans under densely populated, low-gap PWB assemblies and is effective on all flux types, including no-clean and water soluble residue.

KYZEN has a platoon of experts deployed at the High-Reliability Cleaning and Conformal Coating Conference at the Chicago Marriott Schaumburg (Nov 18-20). Organised by IPC and SMTA, the Conference will cover technological developments in all areas of cleaning and coating applied to electronics assemblies.

KYZEN will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT) at the Renaissance Johor Bahru Hotel in Johor, Malaysia (Nov 11-13). “Understencil Wipe Cleaning Yield Improvements” was written by KYZEN’s Mike Bixenman, D.B.A., Shea Engineering’s Chrys Shea, Vicor Corporation – VI Chip Division’s Ray Whittier, and Indium Corporation’s Brook Sandy-Smith. The f...

A stencil cleaning agent will be on display at SMTA International 2014, scheduled to take place between September 30th and October 1st, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Kyzen's AQUANOX A8830 Stencil Cleaning Agent is an environmentally progressive formulation that is highly effective at removing all types of solder pastes from fine-pitch apertures.

  Scheduled from 3rd to 5th September 2014 in Taipei City, Taiwan, Kyzen will exhibit in booth 1226 at SEMICON Taiwan. The company will demonstrate the MICRONOX MX2302 wafer-level cleaning solution and the AQUANOX A4638 advanced packaging cleaning chemistry.

In Booth A-1P35 at Nepcon South China 2014, scheduled to take place between 26th and 28th August, 2014 at the Shenzhen Convention & Exhibition Center in China, Kyzen will exhibit the AQUANOX A8820. The AQUANOX A8820 effectively removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems.

Kyzen will showcase its new stencil cleaning line at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 17, 2014 at the Doubletree Cleveland. The new line includes AQUANOX A8820, AQUANOX A8830 and CYBERSOLVC8882.

At SMTA Dallas, March 4 in Plano, Texas, and SMTA Houston, March 6 in Stafford, Texas, Kyzen will exhibit the AQUANOX A4639 electronic assembly aqueous solution. Effective on B-side misprints, the A4639 biodegradable aqueous solution protects solder joints from chemical attacks and does not contain CFCs or HAPs.

Kyzen will debut its new InstaTrak monitoring system in Booth #1401 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. InstaTrak is an add-on monitoring system that captures the process data of an in-line aqueous cleaning system.

Kyzen is highlighting the new AQUANOX A4639 Electronic Assembly Aqueous Solution in Booth #1401 at the upcoming IPC APEX Expo, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.

Kyzen announces that its Technical Sales Manager Mr. TC Loy and Senior Account Manager Ms. Lily d/o Sanarajoo will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.

Kyzen announces that David Lober will present “Under stencil wiping: Does it benefit your process?” at the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL. The presentation will take place during Session SMT3 titled “SMT Printing Technology,” on Tuesday, October 16, 2012 from 4-5:30 p.m. in room Asia 2.

Kyzen announces that Mike Bixenman, Tom Forsythe and Jack Reinke will lead some of the technical sessions during the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL.

Kyzen has announced today that it will showcase its AQUANOX A4638 Advanced Packaging Cleaning Chemistry in Booth #217 at the upcoming IMAPS 45th International Symposium on Microelectronics, scheduled to take place September 9-13, 2012 at the Town & Country Resort & Conference Center in San Diego, CA.

Kyzen has today revealed that Dr. Mike Bixenman will present a paper titled “Cleaning Challenges in an HDI World – Phase 3” at the upcoming IPC Midwest Exhibition & Conference in Schaumburg, IL. Co-authored with Mark Northrup of IEC Electronics and Joe Russeau of Precision Analytical Laboratory, the presentation will take place during Session S01, titled “Reliability Challenges for Bottom Termination Components” on Wednesday, August 22,...