At embedded world 2022, Electronic Specifier's Editor, Mick Elliott, speaks with Axel Stoermann, Vice President of Embedded Products at KIOXIA Europe about the products they are exhibiting at the show.

At embedded world 2022, KIOXIA Europe announced sampling of the XFM Ver.1.0-compliant removable PCIe attached, NVMe storage device in capacities of 256GB and 512GB: the XFMEXPRESS XT2.

KIOXIA Europe GmbH (formerly Toshiba Memory Europe GmbH) will present its product line-up of high-end embedded flash memory solutions for automotive, consumer, industrial and telecom infrastructure applications.

KIOXIA Europe GmbH has announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new line-up utilises the company’s BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences.

KIOXIA EDSFF E1.S SSDs now available for hyperscale data centers

KIOXIA Europe has announced KIOXIA Corporation’s plans for a 20 billion yen investment to expand its Technology Development Building at its Yokohama Technology Campus and to establish its new Shin-Koyasu Advanced Research Center.

KIOXIA Europe has confirmed the appointment of Asayuki Nannichi as its new president. He replaces the previous president Masaru Takeuchi. Mr Nannichi has thirty years industry experience, occupying high level sales and marketing roles in Japan, North America and EMEA. Under his leadership, KIOXIA Europe will now prepare itself to address the numerous challenges and opportunities that are currently emerging within the European data storage ma...

KIOXIA Europe has announced sampling of its 1 terabyte (TB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in a 1.1mm-high package, the new product utilises KIOXIA’s BiCS FLASH 3D flash memory and achieves sequential read speed of up to 2,050MB/sec and sequential write speed of up to 1,200MB/sec.

KIOXIA Corporation held a ceremony for its semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. According to the company, the facility will be one of the most advanced manufacturing operations in the world, dedicated to the production of its proprietary 3D flash memory BiCS FLASH. The first phase of construction is scheduled to be completed by the spring of 2022.

KIOXIA and Western Digital have announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilising a wide range of technology and manufacturing innovations.

When it comes to selecting memory storage for new applications, design engineers and product developers seemingly have a wealth of storage choices at their fingertips. Bruno Trematore, Chief Engineer, Kioxia explains more.

KIOXIA Europe has announced it will be expanding its Kitakami Plant site in Iwate Prefecture, Japan to further increase production capacity of its proprietary 3D Flash memory BiCS FLASH. The 136,000 square metre area adjacent to the current site will create room for the future construction of the company's 'K2' manufacturing facility, with site preparation work to commence in spring of 2021 and be completed by spring of 2022.

KIOXIA Europe, the European-based subsidiary of KIOXIA Corporation, has announced the construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D flash memory BiCS FLASHTM. The construction of KIOXIA Corporation’s Fab7 facility is expected to commence in the spring of 2021.

KIOXIA Europe has developed and started shipment of engineering samples of next-generation Enterprise & Datacentre SSD Form Factor (EDSFF) E3.S, and which is being standardised by the SNIA SFF TA Technical Work Group. E3.S is a new form factor standard for NVMe SSDs in cloud and enterprise data centres, especially targeting PCIe 5.0 and beyond.

KIOXIA Europe (formerly Toshiba Memory Europe) has announced that it has started sampling Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.

A fifth-generation BiCS FLASH three-dimensional (3D) flash memory featuring a 112-layer vertically stacked structure has been successfully developed by KIOXIA Europe. The company has plans to start shipping samples of the new device, which has a 512 gigabit (64 gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology, for specific applications in the first quarter of the calendar year 2020.

Visitors can meet KIOXIA Europe (formerly Toshiba Memory Europe) at embedded world 2020, the international trade fair for advancements in and around embedded systems, including new developments for security in electronic systems, artificial intelligence (AI), Internet of Things (IoT), e-mobility, energy efficiency and more advancement for our digital world.

KIOXIA Europe has announced the development of the first three-dimensional (3D) semicircular split-gate flash memory cell structure 'Twin BiCS FLASH' using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves programme slope and a larger programme/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells.

The next generation of automotive systems are hungry for more. More advanced infotainment and ADAS systems. More storage for event data recording. Support for more 3D mapping. In a move that makes ‘more’ a reality, KIOXIA Europe (formerly Toshiba Memory Europe) has announced that it has begun sampling the industry’s first 512GB Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory so...