This paper is an educational piece directed toward engineers, engineering managers and corporate decision makers who are seeking new ways to shrink the size and lower the cost of their products as well as protect their IP through custom integration. By Bob Frostholm, Vice President of Marketing & Sales, JVD Semiconductors.

Thermal Test Chips (TTCs) designed by JVD can be used to save time and money in the design and thermal management of ASICs and ASSPs, by allowing thermal engineering of components prior to investment in the expensive silicon required for production. With smaller, more powerful, faster devices thermal management is an ever-increasing concern for designers.

JVD announce the availability of a second critical piece of IP for Analog Front Ends. Following the announcement of the SCi310 Current to Voltage Converter in January, JVD, in conjunction with Systemcom, has made available two additional IP blocks designed for conditioning signals from sensors where the generic information about the phenomenon being detected, whether light or other physical or chemical or electromechanical apparatus, passes the f...

Designed as a silicon IP module to be integrated with additional circuitry unique to the customer’s application needs, the SCi310 critical Analog Front End IP block has been intoduced by JVD. It is suitable for conditioning signals from sensors where the generic information about the phenomenon being detected, whether light or other physical or chemical or electromechanical apparatus, passes the first electrical conversion as a current...