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ITEC
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ITEC Articles
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Industrial
28th May 2024
Flip-chip die bonder from ITEC
ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.
Passives
15th November 2023
ITEC release industry's 'fastest and most precise' RFID inlay die bonder
ITEC has unveiled its ADAT3 XF Tagliner, setting a new industry benchmark with placement speeds reaching 48,000 Units Per Hour (UPH).