IRT Nanoelec has announced the first co-integration of a III-V/silicon laser and silicon Mach Zehnder modulator demonstrating 25Gbps transmission on a single channel. This transmission rate usually is achieved using an external source, over a 10 km single-mode fiber.

  IRT Nanoelec and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realised an innovative 3D chip called 3DNoC to demonstrate the use of 3D stacking technology in scalable, complex digital SoCs.

IRT Nanoelec and CMP are jointly launching a platform for Multi-Project-Wafer, post-process 3D integration (3D-MPW). The disruptive 3D configurations and assemblies created by this IRT Nanoelec/CMP initiative are designed to promote 3D integration. This service, the first of its kind, extends CMP’s regular MPW offer by using 3D post-process technologies at wafer level from IRT Nanoelec.