Invensas will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array Package-on-Package product, at the upcoming IEEE Electronic Components & Technology Conference in Las Vegas, NV on May 28 - 31, 2013.

Invensas will display its latest xFD design wins and product implementations at Computex Taipei, June 4 - 8, 2013, including tablet and Ultrabook solutions from ASUSTeK Computer featuring SK hynix DRAM memory, Dell notebooks fabricated by Compal Electronics and Intel Xeon-based servers featuring standard registered Dual Inline Memory Modules and Hypercloud DIMMs from Netlist.

Invensas Corporation have today announced that Hermes Testing Solution has signed a long-term license agreement to manufacture and sell xFDTM based products into the tablet, mobile computing, and data storage markets. Invensas and its partners will be demonstrating xFD-based products this quarter at the Intel Developer Forum, Beijing (April 2013), ECTC, Las Vegas (May 2013), and Computex, Taiwan (June 2013), among other events.

Invensas Corporation announced today that its new xFD DIMM-in-a-Package memory technology has been licensed to an original equipment manufacturer, and this technology will be demonstrated in Intel-based Ultrabooks at CES 2013.

Invensas Corporation today introduced its DIMM-IN-A-PACKAGE multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package.