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Inseto (UK) Ltd

Inseto (UK) Ltd Articles

Displaying 1 - 4 of 4
Power
12th April 2022
DER-IC takes delivery of micro-punch sinter press

Inseto has supplied Driving the Electric Revolution Industrialisation Centre (DER-IC) North East with equipment to enhance its power electronics, machines and drives (PEMD) capabilities.

Component Management
12th December 2019
Chip bonding adhesive delivers die shear strength of 60N/mm2

A thermally conductive, electrically insulating adhesive from DELO is available at distributor Inseto. The MONOPOX TC2270 is ideal for bonding silicon die and other applications where rapid heat transfer is essential. Heat build-up is a common reason for integrated circuit failure and the efficient dissipation of heat in power semiconductors, as used in automotive applications is a consdierable challenge.

Power
30th January 2018
Acquisition leads to semiconductor product expansion

Technical distributor of equipment and materials to the microelectronic research and manufacturing sectors, Inseto, has acquired IDB Technologies, the supplier of semiconductor wafers and substrates. The two companies have worked closely together for several years and share many of the same customers, who now stand to benefit greatly from the combined resources and technical expertise.

Analysis
30th July 2007
Senju appoints Inseto as its UK Distributor

The PCB Assembly Products Division of Inseto has announced that it has been appointed as the new UK distributor for Senju. Senju manufactures a comprehensive range of electronics grade solders and related materials including paste, wire, spheres, bar and flux, and are renowned for their leadership in lead-free soldering materials, which were introduced and patented in Japan during 1993, over 14 years ago.

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