Lowering part counts to reduce system cost, improve reliability and maintain high ruggedness, a 700W L-Band RF power transistor has been introduced by Infineon Technologies. The company has claimed that the PTVA127002EV features the industry's highest L-Band output power (700W) available for radar systems operating in the 1200-1400MHz frequency range.

Complementing the exisiting Medium Voltage portfolio, the OptiMOS FD 200V and 250V has been launched by Infineon. The latest generation of Power MOSFETs is optimized for body diode hard commutation and leads to higher device ruggedness, lower voltage overshoot and reduced reverse recovery loss.

At embedded world 2014, Infineon has announced volume production of its XMC1000 microcontrollers that offer 32-bit performance at 8-bit prices. Utilising the ARM Cortex-M0 processor, the MCUs are consistently optimised in line with their target applications: sensor and actuator applications, LED lighting, simple motor drives and digital power conversion.

Focusing on system efficiency and demanding reliability requirements for induction cooking applications, the 20A RC-H5 IGBTs have been announced by Infineon Technologies. The 1350V Reverse Conducting (RC) soft switching IGBT provides up to 30% reduction in switching losses compared to previous generations.

Enabling mobile devices that are lighter, faster and more robust, the ESD105 series of Transient Voltage Suppression (TVS) diodes have been announced by Infineon. Supplied in miniaturised integrated packages, the TVS diodes protect high speed interfaces of electronic systems from Electrostatic Discharge (ESD) strikes.

Infineon Technologies’ new ORIGA 3 Battery Management IC protects smartphone and tablet computer users from unpleasant surprises. Its proprietary PrediGauge technology allows for highly accurate fuel gauging thus minimizing the risk of unexpectedly running out of power. 

Designed specifically to enhance the data rate in smartphones, the BGA7x1N6 and BGM7xxxx4L12 series of LTE LNAs and Quad LNA banks have been introduced by Infineon. In order to increase system sensitivity and ensure the best possible user experience, the LNAs and LNA banks are located in both the diversity and main antenna path of the phone.

Claiming to be the first dual-Hall device with integrated Hall plates oriented vertically and not horizontally on the chip surface, the TLE4966V from Infineon detects rotation direction and speed. With the Hall plates orientatated vertically and at 90°, the sensor is sensitive to magnetic fields with in-plane direction and provides flexibility to fit designs into space-constrained areas.

For the tenth time in a row, Infineon Technologies has been named the world's leading supplier of power semiconductors by a report from market research institute IHS Inc. Coming in at number two in the report was Toshiba with a market share of 7.1%, compared with Infineon's 11.8% market share. During the 2012 study period, the market volume for power semiconductors dropped by nearly 16 percent to US Dollar 15 billion.

At the SPS IPC Drives trade fair, Infineon debuted its new 1EDI EiceDRIVER Compact Single Channel Gate Driver. Ideal for applications with isolation voltages of up to 1200 volts and based on Infineon's Coreless Transformer Technology, the 1EDI EiceDRIVER IC enables output currents of up to 6 amperes on separate output pins.

Infineon Technologies announce the new SLE78 security controller for electronic passports. Featuring the industry’s highest memory density and data transfer rate, the new SLE78 with ‘Integrity Guard’ technology provides secure storage of personal and biometric data as well as for electronic visas or entry and exit stamps. These will also require on-chip storage in future ePassports.

Infineon Technologies introduce 50V LDMOS transistors designed for use in UHF TV broadcast transmitters, including one device providing the highest peak power output available for this application. The higher power output across the entire 470 – 806 MHz TV broadcast band gives amplifier designers the option to use fewer transistors to achieve target output power, which translates to cost savings due to lower component count and higher relia...

Today at the European Microwave Week tradeshow, Infineon announced the latest generation of its pico GNSS modules for smartphones. BGM1143N9 is a combination of a low-insertion-loss pre-filter and Infineon’s high performance low noise amplifier in a TSNP-9 package. It is the smallest module worldwide, features very high linearity, lowest noise figure and supports all navigation standards including GPS, GLONASS and BeiDou.

Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems. The transceiver family provides a complete radio frequency front-end for wireless communication in 57-64 GHz, 71-76 GHz, or 81-86 GHz millimeter wave bands. Paired with a baseband/modem, the system solution requires less space, offers improved reliability and lower cost for the critical wireless backhaul links needed in mobile base ...

Infineon Technologies have today announced the availability of a free VDE certified IEC 60730 self-test library for its XMC1000 and XMC4000 families of industrial 32-bit microcontrollers. With the Infineon Class B library packages, the XMC1000 and XMC4000 families satisfy the requirements defined by IEC 60730 Class B, a standard which is mandatory since October 2007 for the safety of household appliances sold in Europe.

Infineon Technologies announce a new family of Trusted Platform Modules that mark the first availability of discrete security chips supporting the next generation TPM 2.0 specification. TPMs are specific microcontrollers that defend computing systems against unauthorized access and attacks.

This very distinct video from Infineon Technologies highlights the key features of their new XMC1000 microcontrollers, including delivering 32-bit power for an 8-bit price.

The largest research project in Europe for researching and developing highly integrated system-in-package solutions has been successfully completed. The ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) project partners have worked out future system-in-package solutions that are more compact and reliable. They have also developed methods for simplifying analyses and tests. Under management of Infineon Technologies, 40 research par...

Infineon Technologies have today announced the introduction of the new 4.5kV modules that expand its IHV portfolio. The 4.5kV IHV modules are reliable and robust with lower conduction and switching losses and the highest power density. The highly insulating 6.5 kV housing offers enhanced protection by means of greater creepage and clearance distance and can be used in demanding environments.

From 2015 onwards, the time that automobiles will need to spend in the repair shop could be significantly decreased. This will be possible thanks to joint research work undertaken by AUDI, Continental, Infineon Technologies and ZMDI. In the DIANA project, the companies have focused their research on ways of improving the analytical and diagnostic ability in electronic control units (ECUs) in vehicles. In three years of research under Infineon&rsq...