At the Infineon stand (A5.506), visitors can expect to see a raft of live demos, exhibits and 'product to system' innovations which add value to application designs. Company CEO, Dr. Reinhard Ploss, will discuss the IoT at the CEO round table and other speakers from the company have slots at the Embedded Platform Conference, Automotive Conference and Embedded Forum.

At European Microwave Week 2014, in booth 152, Infineon is presenting a full system design for the wireless connection of base stations to the corresponding base station controller of a mobile communications network. Based on Infineon’s E-/V-band transceiver family, the wireless backhaul system design offers maximum flexibility and competitiveness by allowing network operators to continuously upgrade in the field.

Infineon has acquired International Rectifier for $3bn. The acquisition creates a behemoth in power management technology. Infineon expands its product portfolio, gets access to International Rectifier’s acclaimed Gallium Nitride on Silicon (GaN) process for power semiconductors, gains a higher profile in the US as well as a larger regional footprint particularly in Asia/Pacific.

With a total of eight RF components in Samsung's Galaxy S5 smartphone, Infineon Technologies has supplied the BGA7L1N6, BGA7M1N6 and BGA7H1N6 LTE LNAs (Low Noise Amplifiers), the BGM7MLLM4L12 and BGM7LLHM4L12 quad-band LTE LNA banks, the BGS12PL6 and BGS12SL6 SPDT RF switches and the BGA824N6S GPS LNA.

As the lifetime of LED lighting fixtures is a function of the LED junction temperature, the desire for compact lighting designs further emphasises the importance of thermal management. By Bernd Pflaum, Principal Engineer, Concept and Development, Linear and Switch mode LED Drivers, Infineon Technologies and Hakan Yilmazer, Head of Technical Marketing, Lighting Application, Infineon Technologies.

There are many advantages to using direct current rather than the alternating current used today. For example, when using direct current there are 5-7% less losses in power grids and electric devices. Direct current also makes it possible to more efficiently feed electric energy from regenerative sources into power grids and energy storage and therefore it improves grid stability.  

Infineon Technologies AG is expanding its Austrian site in Villach. Core emphasis is the on the expansion of expertise for the manufacturing of the future as well as research and development (R&D). “Pilot Space Industry 4.0” will realize and put to the test an innovative concept for networked and knowledge-intensive production.

New semiconductor materials could mean 50% less energy loss in switched-mode power supplies for PCs, flat-screen televisions, servers and telecommunications systems and could make solar inverters even more compact and cost-efficient. The partner companies of the research project “NeuLand” have developed highly-integrated components and electronic circuits which made it possible to reduce energy loss in circuits by 35% as early as duri...

In the future it will be possible to use IGBT High Power Modules (IHM) from Infineon Technologies AG even longer. More robust construction and greatly improved thermal conductivity behaviour increase the average life time in comparison to previous models by a factor of up to 11 under the same conditions of use. A major advantage here is that the electrical and mechanical parameters of the module remain the same in spite of the necessary changes i...

Combining two power MOSFETs and a DC/DC driver IC with integrated current and temperature sensing, the DrBlade 2 power stage device has been introduced by Infineon. The low-profile package of the device, which uses galvanic and lamination processes to reduce footprint and height, aids engineers of server and datacom applications in handling high power density requirements and in shortening design-in cycles. 

Infineon Technologies has shipped more than one billion RF switches used in smartphones and tablet products. It is expected that the demand for RF switches will show double-digit growth over the next years mainly driven by the increased number of LTE bands integrated in the next generation of smartphones and tablets.

The introduction of a series of antenna tuning ICs signals an expansion of Infineon's IC solutions for the RF front end. Instrumental in improving end user experience in 4G smartphones and tablets, the BGA1xGN10 ICs optimise antenna characteristics to allow for highest data rate operation in relevant LTE bands.

Previously requiring two sensors, the TLE4966V vertical dual-Hall sensor from Infineon supplies information on both rotation direction and speed. The sensor is suited for energy-sensitive electronic automotive systems, such as power window and trunk lift, sun roofs and seat adjustment, as well as for escalators, electric shades and electric blinds.

Developed for high-end systems in the industrial sector, Infineon Technologies has introduced the 1EDS-SRC EiceDRIVER Safe driver. The component features the first Slew Rate Control (“SRC”) adjustable in real-time at the IGBT and the secure electric isolation of complies with the strict specifications of VDE 0884-10 and has specially developed short-circuit protection functions.

Infineon Technologies announces a new leadless surface mounted (SMD) package for CoolMOS MOSFETs, designated ThinPAK 5x6. With its height of only 1mm and with its very small footprint of 5x6mm, the ThinPAK 5x6 provides 80% volume reduction in comparison to traditional SMD packages such as DPAK.

Extending the latest generation of reverse conducting IGBTs for resonant applications, Infineon Technologies has announced the 650V RC-H5 family including a monolithically integrated RC diode. These high performance devices are suitable for applications such as multi-hob induction stoves and inverterised microwave ovens, as well as for all partial hard-switching half-bridge topologies.

Hoping to shape the future of electromobility, an electric motor constructed by the 4 German partners in the European research project “MotorBrain" will be presented at the Hannover Messe “MobiliTec” fair, stand of the German federal government (Hall 27, Stand H51). The 4 partners of the project included Infineon Technologies, Siemens, the Institute of Lightweight Engineering and Polymer Technology at the Technisc...

The three-year “eRamp” project, led by Infineon Technologies, has been launched to strengthen and expand Germany and Europe as centres of expertise for the manufacture of power electronics. Focused on energy efficiency, 26 research partners from six countries are participating in the €55m project.

Improving the security of electronic devices in connected systems, OPTIGA Trust P is a programmable hardware-based solution from Infineon Technologies. This provides robust device authentication, protects computing systems from both intentional attacks and accidental damage from user error, and enhances security and privacy of stored data.

The "InduKOCH" research project has been completed by E.G.O. Group, the University of Bremen's Institute for Electrical Drives, Power Electronics and Devices (IALB), and Infineon Technologies, who headed the project. The three-year research project has reduced the number of components that induction stoves require, making them more affordable and more energy efficient.