A radar sensor system, which monitors the blind spot in the car’s rear section, has been developed by Infineon Technologies and German automotive supplier, Hella. The radar scan detects moving objects even in poor weather and independent of the direction and speed of their motion. For precision, the system features antennas, which, for example, warn drivers of vehicles coming from behind when changing lanes. 

Optimised for 50Hz to 20kHz switching frequencies typically found in PV and welding inverters, Infineon announces a new class of low saturation voltage (V CE(sat)) IGBTs. The L5 family is based on the TRENCHSTOP 5 thin wafer technology with an optimised carrier profile further reducing the intrinsically low conduction losses.

For the fifth consecutive time, Infineon Technologies has been included in the Sustainability Yearbook by the Swiss investment company RobecoSAM, ranking them among the world’s 15% most sustainable companies.

  Infineon has announced that it has closed the acquisition of International Rectifier, which has become part of Infineon following the approval of all necessary regulatory authorities and IR’s shareholders.

  Why connected systems require hardware-based security. By Juergen Spaenkuch, Division Vice President Chip Card & Security at Infineon Technologies.

At the Annual General Meeting on 12th February 2015 in Munich, the current members on the capital side of the Supervisory Board of Infineon Technologies will be standing for re-election. The capital side of the Supervisory Board is currently represented by Wolfgang Mayrhuber, Hans-Ulrich Holdenried, Prof. Dr. Renate Köcher, Dr. Manfred Puffer, Prof. Dr. rer. nat. Doris Schmitt-Landsiedel and Dr. Eckart Sünner.

Infineon Technologies and United Microelectronics (UMC) have extended their manufacturing partnership into power semiconductors for automotive applications. Previously, UMC had been producing Infineon’s logic chips for more than 15 years. Under the agreement, the companies will transfer Infineon’s automotive-qualified Smart Power Technology (SPT9) to UMC, and extend its production to 300mm wafers. Production of SPT9 products at UMC&rs...

 Allowing users to reduce the complexity of password-based log-on to services, and strengthen protection against unauthorised access, Infineon has released security chips and Fast IDentity Online (FIDO)-Ready authenticator reference designs.

Designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV, two power module platforms have been released by Infineon Technologies. Currently, the power module platforms are suitable for 3.3, 4.5, and 6.5kV IGBTs measuring 100x140x40mm. 

  Compatible with the Arduino Uno R3, two shields have been announced by Infineon Technologies for RGB lighting and motor control applications. Both shields can be combined with the XMC1100 Boot Kit which is equipped with a 32-bit MCU from the XMC1000 family.

Infineon Technologies has announced that it will acquire a 9.4% stake in Schweizer Electronic. The relevant contracts were concluded today with both companies agreeing on strict confidentiality regarding the terms.

To address the specific requirements of cost-effective applications, Infineon Technologies has released bipolar power modules in solder bond technology. The PowerBlock modules expand the company’s power module portfolio which, thus far, was only using pressure contacts. Infineon offers optimised solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by co...

  The TO-247PLUS package has been introduced by Infineon Technologies, expanding its discrete IGBT portfolio for high power applications. The package, which has the same footprint and pin-out as JEDEC standard TO-247-3, enables up to 120A IGBT co-packed with a full rated diode.

To address the growing trend towards intelligent motor control, Infineon Technologies has introduced the ARM-based Embedded Power family of bridge drivers at electronica 2014. Claimed to be an industry first, the drivers feature a high-performance MCU powered by the ARM Cortex-M3 processor, NVM, analogue and mixed signal peripherals, communication interfaces and MOSFET gate drivers.

The Boosted NFC Secure Element from Infineon Technologies is being supplied to Watchdata Technologies for it’s Sharkey smart wearable devices. These devices, which are available as smart watches or wristbands, enable a mobile lifestyle, operating as secure bank cards when shopping or contactless tickets when taking public transportation combined with personal sport management functions.

Addressing the need for increased power density and space saving in applications requiring high efficiency, Infineon Technologies has released a variant of the TO-247 package. The TO-247 4 Kelvin-Sense package provides efficiency levels previously unavailable when used together with the company’s TRENCHSTOP 5 IGBT and Rapid diode technologies. 

CIPURSE-compliant security chips for contactless transport ticketing, micro-payment, authentication and access solutions are now supplied by Infineon Technologies. Now offering CIPURSE4move, CIPURSEmove and CIPURSESAM, the company claims to be the world’s first supplier of a complete CIPURSE portfolio.

  Designed for official documents, the Dual Interface CoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.

RESCAR 2.0 (Robuster Entwurf von neuen Elektronikkomponenten für Anwendungen im Bereich Elektromobilität - Robust design of new electronic components for applications in electromobility), a collaborative research project which includes Audi, Bosch, Elmos Semiconductor, FZI and Infineon, has improved the reliability and robustness of electronic systems for EVs, and made ECUs of the future four times more durable.

  Reliable and precise sensing of the Electric Power Steering (EPS) torque in an electric power steering system has previously always required two sensors to function. Thanks to Infineon's dual-sensor package innovation, only one sensor chip is likely to be required in future.