Heraeus Electronics is pleased to announce its involvement in the FastLane project, a forward-thinking EU-funded initiative dedicated to transforming the European value chain for Silicon Carbide (SiC)-based power electronics.

Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe.

Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau.

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.

Heraeus Electronics has announced its receipt of the ‘2023 GLOBAL Technology Award’ in the category of Solder Paste.

Heraeus Electronics is pleased to announce that it has been honoured with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean.

Heraeus Electronics has been awarded ‘Best Material Supplier of 2022’ by STMicroelectronics’ Bouskoura test and assembly site.

Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals.

Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project ‘KuSIn - Copper sinter processes using induction heating for electromobility application,’ funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).

Heraeus Electronics has been honoured by Bosch, a leading global supplier of technology and services, with the renowned Bosch Global Supplier Award in the category "Raw Material and Components" for its exceptional performance.

Heraeus Electronics introduces the PTC4900 Series self-regulating heater inks, a breakthrough in heater technology.

Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. 

Heraeus Electronics is pleased to announce the development of a production-friendly, flexible passive component termination ink.

Heraeus Electronics announces the release of its new Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste.

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place 1st – 2nd February 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place 25th to 27th January 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Centre in California.

Heraeus Electronics announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.

Heraeus Electronics has announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe.

Heraeus Electronics has announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.