GOEPEL electronic
- Goeschwitzer Str. 58/60
Jena
07745
Germany - +49-3641-68960
- http://www.goepel.com
- +49-3641-6896944
GOEPEL electronic Articles
GOEPEL electronic demonstrates IJTAG (IEEE P1687) support in SYSTEM CASCON
GOEPEL electronic introduces a prototype version of the Company’s JTAG/Boundary Scan software platform SYSTEM CASCON with integrated tools supporting the current version of the upcoming IEEE P1687 (IJTAG) standard. IEEE P1687 focuses on the standardisation of the access to and the documentation of the control of chip-embedded instruments, without limiting the number or type of instruments.
Test of ECUs with LIN 2.0 Interface
The LIN bus was standardized in the late 1990s, and has been in widespread use in the automotive industry since. The reason for its introduction was the necessity to increase the communication capability that pushed the envelope of CAN networks because of high numbers of ECUs and data volume in vehicles. From an economic point of view the challenge was to develop a cheaper alternative to the relatively complex CAN interface. A LIN network always...
Series 61 – a Test Tool that’s growing
The “joker in a test system” – today CAN, tomorrow LIN, the day after tomorrow FlexRay and next week all together?
MOST150: End-of-line testing for Quality Assurance (QA)
Since the first generation of MOST networks in vehicles, the range of users is still growing, with the result that many different suppliers are developing electronic control units (ECU) providing a MOST interface. Therefore detailed compliance testing is required in order to eliminate faults and to ensure the correct behaviour of different MOST interfaces in the same network. By focusing on the challenge of testing, the PXI standard and simultane...
GOEPEL electronic expands GATE
GOEPEL electronic announces the incorporation of Testing House Korea Co, Ltd as the newest member in the global GATE (GOEPEL Associated Technical Experts) alliance program. THK, based in Bundang City of South Korea, has already been a GOEPEL electronic Centre of Expertise (CoE) for several years.
GOEPEL electronic enlists chip-embedded instrumentation for high-speed RAM Access Test
Structured as modular, intelligent IP and developed in close cooperation with the company Testonica within the framework of the GATE alliance program, these new ChipVORX models enable high-speed access tests for any kind of Random Access Memory (RAM) devices with full automation of the test development workflow. Users can utilise this new method to close significant holes in fault coverage affecting the test of modern electronics.
GOEPEL electronic enables graphical JTAG/Boundary Scan Project Development
GOEPEL electronic introduces a new graphical user interface for the company’s JTAG/Boundary Scan software platform SYSTEM CASCON.
New Digital I/O Module on PXI Basis for signal critical Desktop Applications
GOEPEL electronic announces the market introduction of PXI5396-DT/x, two additional JTAG Digital I/O Modules on PXI bus basis. The PXI5396-DT/x modules support structural JTAG/Boundary Scan tests as well as dynamic I/O operations up to 100 MHz for functional test executions. They feature an impedance controlled VPC interface for direct coupling to signal critical load boards or other verification environments. Consequently, users are now able to ...
GOEPEL electronic - New Test and Programming Strategies for Texas Instruments DaVinci Media Processors
GOEPEL electronic, world-class JTAG/Boundary Scan vendor, has developed special VarioTAP® IP’s for TI’s DaVinci Digital Media Systems-on-Chip (DMSoC) for the TMS320DM3xx series. The solution enables the utilisation of dynamic processor emulation tests for detection and diagnosis of faults on board and at system level, supporting an ultra-fast programming of connected memory media. The user benefits are a significant increase in fault coverag...
FPGA embedded ChipVORX IP enables ultra fast Flash Programming
GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std.1149.x announces the development of special ChipVORX® model library series for FPGA accelerated in-system programming (ISP) of Flash components. The ChipVORX® models developed in cooperation with the Tallinn/Estland based Company Testonica are structured modularly as intelligent IP. They enable the ultra fast in-system programming of every kind of Flas...
GOEPEL electronic will exhibit leading Test Equipment at NEPCON Shenzhen 2011
At this year’s NEPCON Shenzhen, GOEPEL electronics Ltd. Asia will present its latest offerings in Multi-Dimensional Boundary Scan Instrumentation as well as chip embedded test, debug and programming tools. By visiting booth 1C27 within the “German Pavillion”, visitors can learn how to enable straightforward control of on-chip or on-system test, debug and programming functions of any complexity, based on the IEEE 1149.1 test bus protocol –...
GOEPEL electronic’s X-Ray and Optical Test Equipment now available in the US
GOEPEL electronic’s Automated X-Ray and Optical Inspection systems (AXI/AOI) are now available to the North American market. This is another important strategic step towards meeting the significantly increased demands for optical test equipment for mounted PCBs in the US and Canada.
eXception integrates GOEPEL electronic’s Boundary Scan into Teradyne Test Station
First Contract Electronics Manufacturer in the UK to incorporate GOEPEL electronic JTAG/ Boundary Scan technology into a Teradyne Test station. The British Contract Electronics Manufacturing Company eXception EMS has simplified and integrated Boundary Scan solutions into mainstream test strategy by incorporating equipment from GOEPEL electronic into a Teradyne test station.
Safe inline X-Ray Inspection of double-sided equipped BGA Components
GOEPEL electronic’s 3D x-ray inspection system OptiCon X-Line 3D enables a safe quality control of solder joints on opposed mounted BGA components, e.g. in double-sided equipped DDR-RAM modules. In the inline production process, single-sided and double-sided equipped PCBs can be inspected within one test run.
GOEPEL electronic supports Picochip in testing next generation ’small cell’ baseband chips
GOEPEL electronic has developed special VarioTAP IPs for testing the new generation of femtocell chips in cooperation with Picochip. The solution enables dynamic processor emulation tests (PET) for fault detection and diagnostic on board and system level, as well as supporting embedded Flash programming.
Cost-efficient LIN Bus Communication on PXI Basis
Providing a new low cost solution supporting ECU communication via LIN bus, GOEPEL electronic specifically aims to support users mainly executing basic tasks in LIN communication, e.g. functional tests of ECUs (electronic control units). The new module is named PXI 3078.
SoundChecker – New cost-efficient Acoustic Analysis System
GOEPEL electronic introduces SoundChecker, a new, cost-efficient complete system for acoustic and impact sound analyses.
GOEPEL electronic combines Boundary Scan with real time Test of GBit LAN Interfaces
GOEPEL electronic introduces BAC9305-LAN1G, the latest Bus Access Cable (BAC) as a new member of the industry leading JTAG/Boundary Scan hardware platform SCANFLEX. For the very first time, in connection with the SCANFLEX® multi port module SFX-9305 the new family member of Bus Access Cables enables the real time test of GBit LAN interfaces in combination with extended JTAG/Boundary Scan operations based on a unique platform. The protocol based...
SoundChecker – New cost-efficient Acoustic Analysis System
GOEPEL electronic introduced SoundChecker, a new, cost-efficient complete system for acoustic and impact sound analyses. The system concept provides an ideal compromise to highly complex acoustic test systems, being a simple introduction and entree to sound analysis.
GOEPEL electronic and SPEA cooperate to integrate Boundary Scan into new Flying Prober Generation
Within the scope of an OEM cooperation, GOEPEL electronic and SPEA developed a professional Boundary Scan option for the SPEA 4060 Flying Prober test system. This integration provides crucial benefits such as increased test and fault coverage as well as significant time savings in the automatic production process.