Electronic Specifier
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Electronic Specifier Articles
MIT researchers develop sound-suppressing silk fabric
In today’s noisy world, from traffic hum to loud neighbours, unwanted sound is a constant problem. An interdisciplinary team from MIT and other institutions has developed a sound-suppressing silk fabric that could create quieter spaces.
‘Better than graphene’ material development
In the rapidly evolving landscape of advanced materials, a new star is rising to challenge the reigning champion, graphene.
New data centre to boost North Lincolnshire job market
Plans for a new data centre in North Lincolnshire, set to create 400 jobs, have been submitted to North Lincolnshire Council.
Electronic Specifier at PCIM 2024
Electronic Specifier has announced its participation in the upcoming PCIM show in Nuremberg, Germany on 11-13th June.
Apple announce new accessibility features for iPad and iPhone
Apple has announced new accessibility features coming later this year, including Eye Tracking, a way for users with physical disabilities to control their iPad or iPhone with their eyes.
Google I/O sees company double down on AI
Hot on the heels of OpenAI’s GPT-4o announcement, Google I/O delivered news on the company’s efforts to double down on its AI development and offerings.
Implementing GaN in power electronics design: key factors
Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.
OpenAI launches its new GPT-4o model
OpenAI’s GPT-4o blends improved audio, vision, and text capabilities with increased performance across the board, bringing it to the top of the LLM tier list.
Robotapillar: the fusion of origami and engineering
Engineers from Princeton and North Carolina State University have crafted a soft robot called the 'Robotapillar' to wiggle past the current limitations of traditional robotics when in tight or dangerous spaces.
New smart contact lenses could help fight glaucoma
New research has developed smart contact lenses that could provide the key to non-intrusive and continuous eye monitoring.
A smart neckband for tracking dietary intake
A new smart neckband has been developed to help users track their dietary habits by monitoring food and fluid intake.
Professor resolves two decades of oxide semiconductor challenges
In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.
Royal Navy embraces VR to train sailors
The Royal Navy is revolutionising its training programme by incorporating advanced Virtual Reality (VR) technologies into its navigational training.
3D-printed living material marries biology and engineering
Scientists have developed a 3D-printed living material that exhibits growth, self-repair, and environmental responsiveness by embedding living cells within a non-living matrix.
'Artificial muscles' help fractured leg bones heal better
A team at Saarland University, which includes medical specialists, engineers, and computer scientists, are developing a smart orthopaedic implant designed to not only monitor but actively encourage the healing of bone fractures.
Trends and challenges in the era of wide bandgap semiconductors for power electronics
Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.
£100k grants for five schools’ climate projects
Five sustainability projects collaborating with UK schools will each receive £100,000 to enhance green initiatives and reduce carbon emissions, as part of the UK schools’ sustainability campaign, Let’s Go Zero.
US revokes chip licenses to Huawei
The US government has revoked licenses previously granted to major semiconductor companies, including Intel and Qualcomm, which allowed them to ship essential chipsets to Huawei Technologies.
What is Scratch 3.0?
Delve into Scratch 3.0, the educational programming language that makes learning coding fun and accessible for kids and beginners.