Companies

Electronic Specifier

Electronic Specifier Articles

Displaying 401 - 420 of 2740
Design
19th May 2024
MIT researchers develop sound-suppressing silk fabric

In today’s noisy world, from traffic hum to loud neighbours, unwanted sound is a constant problem. An interdisciplinary team from MIT and other institutions has developed a sound-suppressing silk fabric that could create quieter spaces.

Design
18th May 2024
‘Better than graphene’ material development

In the rapidly evolving landscape of advanced materials, a new star is rising to challenge the reigning champion, graphene.

Latest
16th May 2024
New data centre to boost North Lincolnshire job market

Plans for a new data centre in North Lincolnshire, set to create 400 jobs, have been submitted to North Lincolnshire Council.

Events News
16th May 2024
Electronic Specifier at PCIM 2024

Electronic Specifier has announced its participation in the upcoming PCIM show in Nuremberg, Germany on 11-13th June.

Latest
16th May 2024
Apple announce new accessibility features for iPad and iPhone

Apple has announced new accessibility features coming later this year, including Eye Tracking, a way for users with physical disabilities to control their iPad or iPhone with their eyes.

Artificial Intelligence
15th May 2024
Google I/O sees company double down on AI

Hot on the heels of OpenAI’s GPT-4o announcement, Google I/O delivered news on the company’s efforts to double down on its AI development and offerings.

Design
15th May 2024
Implementing GaN in power electronics design: key factors

Here, you can find out the key factors to consider when implementing GaN in power electronics design processing, and the challenges of doing so.

Blog
14th May 2024
What is fan out wafer level packaging?

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

Artificial Intelligence
14th May 2024
OpenAI launches its new GPT-4o model

OpenAI’s GPT-4o blends improved audio, vision, and text capabilities with increased performance across the board, bringing it to the top of the LLM tier list.

Robotics
14th May 2024
Robotapillar: the fusion of origami and engineering

Engineers from Princeton and North Carolina State University have crafted a soft robot called the 'Robotapillar' to wiggle past the current limitations of traditional robotics when in tight or dangerous spaces.

Wearables
13th May 2024
New smart contact lenses could help fight glaucoma

New research has developed smart contact lenses that could provide the key to non-intrusive and continuous eye monitoring.

Wearables
12th May 2024
A smart neckband for tracking dietary intake

A new smart neckband has been developed to help users track their dietary habits by monitoring food and fluid intake.

Design
11th May 2024
Professor resolves two decades of oxide semiconductor challenges

In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.

VR/AR
10th May 2024
Royal Navy embraces VR to train sailors

The Royal Navy is revolutionising its training programme by incorporating advanced Virtual Reality (VR) technologies into its navigational training.

Eco Innovation
9th May 2024
3D-printed living material marries biology and engineering

Scientists have developed a 3D-printed living material that exhibits growth, self-repair, and environmental responsiveness by embedding living cells within a non-living matrix.

Medical
9th May 2024
'Artificial muscles' help fractured leg bones heal better

A team at Saarland University, which includes medical specialists, engineers, and computer scientists, are developing a smart orthopaedic implant designed to not only monitor but actively encourage the healing of bone fractures.

Design
8th May 2024
Trends and challenges in the era of wide bandgap semiconductors for power electronics

Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.

Eco Innovation
8th May 2024
£100k grants for five schools’ climate projects

Five sustainability projects collaborating with UK schools will each receive £100,000 to enhance green initiatives and reduce carbon emissions, as part of the UK schools’ sustainability campaign, Let’s Go Zero.

News & Analysis
8th May 2024
US revokes chip licenses to Huawei

The US government has revoked licenses previously granted to major semiconductor companies, including Intel and Qualcomm, which allowed them to ship essential chipsets to Huawei Technologies.

STEM News
8th May 2024
What is Scratch 3.0?

Delve into Scratch 3.0, the educational programming language that makes learning coding fun and accessible for kids and beginners.

First Previous Page 21 of 137 Next Last

Featured products

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier