Electronic Specifier
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Electronic Specifier Articles
TI Engineer wins PS4
At electronica 2014, Stefan Isermann has won the first PS4 in Electronic Specifier's daily competition. The Texas Instruments Engineer was overjoyed when he came to collect the Driveclub bundle from A4.142.
Visit us at electronica to win a PS4 bundle
Electronic Specifier will be exhibiting as an official Media Partner at electronica 2014. Visit us in A4.142, where each day there will be a prize draw to win a PS4 Driveclub bundle. Plus, meet the Electronic Specifier team for a drink at our stand, every day from 4pm.
Security takes centre stage at electronica 2014
The Electronic Specifier Security Forum takes place on Wednesday 12th November, Hall A3 between 10:00 and 13:00. There’s no need to book but places will be limited, so arrive early to secure a seat. Here is a full list of participants in the forum, and their chosen topic for discussion:
Electronic Specifier to host round-table on security at electronica 2014
Electronic Specifier will be hosting an Industry Round-Table at electronica 2014, Messe Munich, Germany, 11th to 14th November. Organised by Electronic Specifier at the invitation of the organisers, the Round-Table will take place on Wednesday 12th in the electronica Forum Area in Hall A3. There will be two 90-minute sessions taking place between 10:00 and 13:00, comprising six industry experts in each session.
Protecting circuits from ESD and other power surges
Protecting circuits from electrostatic discharge and other power surges is becoming more difficult with smaller chip geometries. Steve Rogerson looks at how the industry is coping.
GaN devices for power electronics are verging on big growth
GaN devices for power electronics are on the verge of big growth, but what are the driving forces behind this growth? Sally Ward-Foxton investigates for ES Design magazine.
Pervasive connectivity is changing the FPGA landscape
The emergence of pervasive connectivity - and the resultant volumes of data that creates - could be changing the landscape for embedded electronics, meaning the old mandate of ‘faster, smaller, cheaper’ may soon just read ‘faster’. Philip Ling, Editor, ES Design magazine, reports.
What autonomous driving technology is now available?
While much of the technology required to realise self-driving cars is now available, Steve Rogerson looks at what still needs to be done.
From 1080p to 4k and beyond
Increasing display resolution and higher refresh rates are putting pressure on today’s display interface standards, writes Sally Ward-Foxton for ES Design magazine.
A look at the latest developments in non-volatile memory
The rate at which modern devices generate data means it should come as no surprise that manufacturers are still actively developing alternative and - hopefully - improved non-volatile memory solutions. Philip Ling, Editor, ES Design magazine, takes a look at some of the most recent developments.
Not-so-common sensors
Steve Rogerson looks at recent developments and trends in automotive sensors for ES Design magazine.
Printed sensor technology is holding strong
Printing sensors is one way to make them cheap enough for widespread IoT applications, and Europe is leading the way in developing this technology, Sally Ward-Foxton writes for ES Design magazine.
Everything is a network
We are entering a new era in networking, where processing is being pushed to the edge and nodes are starting to look more like networks in their own right. Philip Ling, Editor, ES Design magazine, reports.
Increasingly connected world needs greater security
As the connected world increasingly becomes a reality in industrial set-ups, there is danger they are becoming more vulnerable to attack. Steve Rogerson looks at the risks for ES Design magazine.
Getting started with motor control
Today’s motor control products increasingly come with a variety of supporting material, including free algorithms, to help speed up time to market. Sally Ward-Foxton reports for ES Design magazine.
Frameworks fuelling the future
Efforts to ease software development now extend to user interfaces, as Philip Ling discovers for ES Design magazine.
Raging trench warfare
The rate of improvement in trench MOSFETs may be slowing down but, as Steve Rogerson found out, there are still some fighting the battle.
The last piece of the puzzle
Thanks to a new process, a CMOS RF power amplifier has matched the performance of GaAs devices for the first time, resulting in new possibilities for reconfigurable RF front ends, reports Sally Ward-Foxton.
Ultra-thin is the new bulk
The quest for smaller, faster, cheaper integrated devices really drives the semiconductor industry from a commercial point of view; an ever-present burden on developers working on the next great process breakthrough. Philip Ling reports for ES Design magazine.
Could graphene FETs drive greater RF integration?
There is growing anticipation that graphene will soon emerge as a replacement for silicon, fuelled by its outstanding promise. Now, a lack of progress towards monolithic integration may have turned an important corner thanks to the latest R&D breakthroughs, as Philip Ling reports.