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Electronic Specifier Articles
Processing power targets sensor fusion
The complex algorithms used by platforms such as the iNEMO Engine to combine the outputs of multiple sensors obviously require processing power; in the iNEMO Engine development boards this is done on a separate ST microcontroller. But why is this ‘sensor hub’ configuration becoming the norm rather than using central processing resources such as the application processor?
Making sense from sensor fusion data
Sensor fusion is becoming a popular technique for increasing the accuracy and useability of data from MEMS sensors in smartphones and other consumer devices. In essence, the technique involves combining data from multiple sensors to produce a faster and more accurate representation of what is happening outside the system.
Thanks for the memories
How is the ultrabook concept creating the conditions to revolutionise memory technology? Vanessa Knivett investigates.
Safety-critical MCUs: what if things go wrong?
Microcontrollers used in vehicles’ safety critical systems need to meet stringent reliability standards. Sally Ward-Foxton takes a look at some of the safety features used in today’s automotive MCUs.
DISPLAYTRONIC LCD Displays available from Transonics
Brilliant LCD displays - LCD, TFT, FSLCD, OLEDs to brighten your product image! Transonics plc. the London based leading supplier of electronic components and logistics solutions, can now supply their customers with a comprehensive range of LCD Displays from leading the Chinese manufacturer DISPLAYTRONIC.
Green Hills Software Announces INTEGRITY 11 - Major Upgrade to the Leading RTOS
Green Hills Software has announced a major new release of its flagship INTEGRITY real-time operating system. INTEGRITY 11 includes performance, communication, and ease-of-use features that address the demanding requirements of next-generation sophisticated embedded systems.
IPC International academic competition winners to present at IPC APEX Expo 2012
IPC is pleased to announce the winning research papers selected in the 2012 IPC International Academic Paper Competition. The authors of these papers will present their research at a free BUZZ session on Thursday, March 1, 2012, at IPC APEX EXPO® in San Diego.
Electronic Specifier launches new wireless site
Electronic Specifier is delighted to announce the introduction of Electronic Specifier Wireless, a new and comprehensive website dedicated in delivering the latest news and articles for the Wireless market. The new site can be found at http://www.wireless-electronicspecifier.com/
Electronic Specifier launches new Optoelectronics site
Electronic Specifier is delighted to announce the introduction of Electronic Specifier Optoelectronics, a new and comprehensive website dedicated in delivering the latest news and articles for the Optoelectronic market. The new site can be found at www.optoelectronics-electronicspecifier.com
Lenovo honours RF Micro Devices with 2011 Best Supplier Award
RF Micro Devices, Inc. announced that Lenovo Mobile Internet and Digital Home Business Group (MIDH) has honored RFMD® with its 2011 Best Supplier Award. Lenovo MIDH is the subsidiary of Lenovo responsible for creating mobile Internet-focused devices, including tablets and smartphones, as well as devices for new categories like cloud computing, smart TV and the digital home.
Multi-core: Giving a car the power of sight
Making sense of images captured by cameras in today’s Advanced Driver Assistance Systems requires sophisticated microprocessors with specific feature sets. But what makes a good image processor? Sally Ward-Foxton investigates.
Texas Instruments & Digi-Key announce Building The Future of Technology webinar series
Targeting electronic engineers, Texas Instruments and Digi-Key have announced their joint presentation of a series of webinars entitled ‘Building the Future of Technology’, hosted by Electronic Specifier.
Avoiding EMI in capacitive touch screens
Capacitive touch has become the technology of choice for high end consumer applications, but the technology is particularly susceptible to EMI. How do the major manufacturers deal with this problem? Asks Sally Ward-Foxton
Lattice's new mixed signal design software simplifies platform management design
Lattice Semiconductor Corporation has announced release 6.1 of its PAC-Designer® mixed signal design software, with updated support for Lattice's Platform Manager™, Power Manager II and ispClock™ devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond® 1.3 software design environment. This integration of the PAC-Designer 6.1 and Diamond 1.3 design software tools will make more advanced digital desi...
New, Completely Automated Radiated Immunity Test System For MIL-STD 461 Testing Now Available From AR
AR RF/Microwave Instrumentation has introduced its latest automated system for conducting radiated susceptibility testing. The AS18027 AR System has been specifically designed to perform automated testing for MIL-STD 461 requirements. The system will produce fields up to 50V/m at 1 meter distance from 1-18 GHz.
Top Electronics Products in the Last 30 Days...
From the thousands of product and technology searches conducted on the site each month, we bring you the most popular and searched for items from the last 30 days, with real-time stock levels and pricing info.
Toshiba Expands GaN HEMT Product Family with Power Amplifier for Extended Ku-Band Satcom Applications
This week at the 2011 IEEE MTT-S International Microwave Symposium, Toshiba America Electronic Components, Inc. (TAEC*) and its parent company, Toshiba Corp., announced the TGI1314-25L, a gallium nitride (GaN) semiconductor High Electron Mobility Transistor (HEMT), the latest addition to its power amplifier product family.
Top 5 Product Searches on ElectronicSpecifier
View the Top Electronics Product Searches in the Last 30 Days on the site, from the thousands of product searches which are performed each month. To make a quick search, use the Free Component Search Tool.
Agilent Technologies' New IO Libraries Suite Adds Connectivity to Latest PXI and AXIe Products
Agilent Technologies Inc. has released a new version of its IO Libraries Suite software for test instrument connectivity and control. Release 16.1 adds additional support for PXI and AXIe instruments and delivers an improved user experience, making it faster and easier to connect to instruments from a wide range of vendors.
LATTICE ANNOUNCES 4 x 3.125Gbps SRIO CAPABILITY ON THE MID-RANGE LatticeECP3 FPGA FAMILY
Lowest Cost, Lowest Power Programmable Gen2 SRIO Solution Available