The complex algorithms used by platforms such as the iNEMO Engine to combine the outputs of multiple sensors obviously require processing power; in the iNEMO Engine development boards this is done on a separate ST microcontroller. But why is this ‘sensor hub’ configuration becoming the norm rather than using central processing resources such as the application processor?

Sensor fusion is becoming a popular technique for increasing the accuracy and useability of data from MEMS sensors in smartphones and other consumer devices. In essence, the technique involves combining data from multiple sensors to produce a faster and more accurate representation of what is happening outside the system.

How is the ultrabook concept creating the conditions to revolutionise memory technology? Vanessa Knivett investigates.

Microcontrollers used in vehicles’ safety critical systems need to meet stringent reliability standards. Sally Ward-Foxton takes a look at some of the safety features used in today’s automotive MCUs.

Brilliant LCD displays - LCD, TFT, FSLCD, OLEDs to brighten your product image! Transonics plc. the London based leading supplier of electronic components and logistics solutions, can now supply their customers with a comprehensive range of LCD Displays from leading the Chinese manufacturer DISPLAYTRONIC.

Green Hills Software has announced a major new release of its flagship INTEGRITY real-time operating system. INTEGRITY 11 includes performance, communication, and ease-of-use features that address the demanding requirements of next-generation sophisticated embedded systems.

IPC is pleased to announce the winning research papers selected in the 2012 IPC International Academic Paper Competition. The authors of these papers will present their research at a free BUZZ session on Thursday, March 1, 2012, at IPC APEX EXPO® in San Diego.

Electronic Specifier is delighted to announce the introduction of Electronic Specifier Wireless, a new and comprehensive website dedicated in delivering the latest news and articles for the Wireless market. The new site can be found at http://www.wireless-electronicspecifier.com/

Electronic Specifier is delighted to announce the introduction of Electronic Specifier Optoelectronics, a new and comprehensive website dedicated in delivering the latest news and articles for the Optoelectronic market. The new site can be found at www.optoelectronics-electronicspecifier.com

RF Micro Devices, Inc. announced that Lenovo Mobile Internet and Digital Home Business Group (MIDH) has honored RFMD® with its 2011 Best Supplier Award. Lenovo MIDH is the subsidiary of Lenovo responsible for creating mobile Internet-focused devices, including tablets and smartphones, as well as devices for new categories like cloud computing, smart TV and the digital home.

Making sense of images captured by cameras in today’s Advanced Driver Assistance Systems requires sophisticated microprocessors with specific feature sets. But what makes a good image processor? Sally Ward-Foxton investigates.

Targeting electronic engineers, Texas Instruments and Digi-Key have announced their joint presentation of a series of webinars entitled ‘Building the Future of Technology’, hosted by Electronic Specifier.

Capacitive touch has become the technology of choice for high end consumer applications, but the technology is particularly susceptible to EMI. How do the major manufacturers deal with this problem? Asks Sally Ward-Foxton

Lattice Semiconductor Corporation has announced release 6.1 of its PAC-Designer® mixed signal design software, with updated support for Lattice's Platform Manager™, Power Manager II and ispClock™ devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond® 1.3 software design environment. This integration of the PAC-Designer 6.1 and Diamond 1.3 design software tools will make more advanced digital desi...

AR RF/Microwave Instrumentation has introduced its latest automated system for conducting radiated susceptibility testing. The AS18027 AR System has been specifically designed to perform automated testing for MIL-STD 461 requirements. The system will produce fields up to 50V/m at 1 meter distance from 1-18 GHz.

From the thousands of product and technology searches conducted on the site each month, we bring you the most popular and searched for items from the last 30 days, with real-time stock levels and pricing info.

This week at the 2011 IEEE MTT-S International Microwave Symposium, Toshiba America Electronic Components, Inc. (TAEC*) and its parent company, Toshiba Corp., announced the TGI1314-25L, a gallium nitride (GaN) semiconductor High Electron Mobility Transistor (HEMT), the latest addition to its power amplifier product family.

View the Top Electronics Product Searches in the Last 30 Days on the site, from the thousands of product searches which are performed each month. To make a quick search, use the Free Component Search Tool.

Agilent Technologies Inc. has released a new version of its IO Libraries Suite software for test instrument connectivity and control. Release 16.1 adds additional support for PXI and AXIe instruments and delivers an improved user experience, making it faster and easier to connect to instruments from a wide range of vendors.

Lowest Cost, Lowest Power Programmable Gen2 SRIO Solution Available